Datasheets
XPC857DSLZP66B by:

IC,COMMUNICATIONS CONTROLLER,BGA,357PIN

Part Details for XPC857DSLZP66B by Freescale Semiconductor

Overview of XPC857DSLZP66B by Freescale Semiconductor

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Applications Industrial Automation Renewable Energy Automotive Robotics and Drones

Part Details for XPC857DSLZP66B

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XPC857DSLZP66B Part Data Attributes

XPC857DSLZP66B Freescale Semiconductor
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XPC857DSLZP66B Freescale Semiconductor IC,COMMUNICATIONS CONTROLLER,BGA,357PIN
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC
Part Package Code BGA
Package Description BGA, BGA357,19X19,50
Pin Count 357
Reach Compliance Code not_compliant
ECCN Code 5A991
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
External Data Bus Width 32
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B357
JESD-609 Code e0
Length 25 mm
Low Power Mode YES
Moisture Sensitivity Level 3
Number of Terminals 357
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA357,19X19,50
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 220
Qualification Status Not Qualified
Seated Height-Max 2.05 mm
Speed 66 MHz
Supply Voltage-Max 3.465 V
Supply Voltage-Min 3.135 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for XPC857DSLZP66B

This table gives cross-reference parts and alternative options found for XPC857DSLZP66B. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XPC857DSLZP66B, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
XPC857TZP66B IC,COMMUNICATIONS CONTROLLER,BGA,357PIN Freescale Semiconductor XPC857DSLZP66B vs XPC857TZP66B
Part Number Description Manufacturer Compare
MPC860SRZQ80D4 PowerQUICC, 32 Bit Power Architecture, 80MHz, Communications Processor, 0 to 95C Freescale Semiconductor XPC857DSLZP66B vs MPC860SRZQ80D4
TS(X)PC860MHMGB/Q50C Microprocessor, 32-Bit, 50MHz, CMOS, CBGA357, CERAMIC, BGA-357 Thales Group XPC857DSLZP66B vs TS(X)PC860MHMGB/Q50C
TS(X)PC860MHMZPB/Q50A3 Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 Thales Group XPC857DSLZP66B vs TS(X)PC860MHMZPB/Q50A3
TS(X)PC860MHMGU/T40B Microprocessor, 32-Bit, 40MHz, CMOS, CBGA357, CERAMIC, BGA-357 Thales Group XPC857DSLZP66B vs TS(X)PC860MHMGU/T40B
MPC860TVR50D4 PowerQUICC, 32 Bit Power Architecture, 50MHz, Communications Processor, 0 to 95C Freescale Semiconductor XPC857DSLZP66B vs MPC860TVR50D4
TSPC860MHMGB/Q40C Microprocessor, 32-Bit, 40MHz, CMOS, CBGA357, CERAMIC, BGA-357 Thales Group XPC857DSLZP66B vs TSPC860MHMGB/Q40C
MPC860SRVR50D4R2 PowerQUICC, 32 Bit Power Architecture, 50MHz, Communications Processor, 0 to 95C Freescale Semiconductor XPC857DSLZP66B vs MPC860SRVR50D4R2
MPC860TZQ50D4R2 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Freescale Semiconductor XPC857DSLZP66B vs MPC860TZQ50D4R2
TS(X)PC860MHVGU/T40(A) RISC Microprocessor, 32-Bit, 40MHz, CMOS, CBGA357, CBGA, 357 PIN Thales Group XPC857DSLZP66B vs TS(X)PC860MHVGU/T40(A)
TS(X)PC860MHMG50B Microprocessor, 32-Bit, 50MHz, CMOS, CBGA357, CERAMIC, BGA-357 Thales Group XPC857DSLZP66B vs TS(X)PC860MHMG50B

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