There are no models available for this part yet.
Overview of XPC755BRX400LE by Motorola Mobility LLC
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Computing and Data Storage
Healthcare
CAD Models for XPC755BRX400LE by Motorola Mobility LLC
Part Data Attributes for XPC755BRX400LE by Motorola Mobility LLC
|
|
---|---|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
MOTOROLA INC
|
Part Package Code
|
BGA
|
Package Description
|
BGA,
|
Pin Count
|
360
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
3A991.A.2
|
HTS Code
|
8542.31.00.01
|
Address Bus Width
|
32
|
Bit Size
|
32
|
Boundary Scan
|
YES
|
Clock Frequency-Max
|
100 MHz
|
External Data Bus Width
|
64
|
Format
|
FLOATING POINT
|
Integrated Cache
|
YES
|
JESD-30 Code
|
S-CBGA-B360
|
Length
|
25 mm
|
Low Power Mode
|
YES
|
Number of Terminals
|
360
|
Package Body Material
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code
|
BGA
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
3.2 mm
|
Speed
|
400 MHz
|
Supply Voltage-Max
|
2.1 V
|
Supply Voltage-Min
|
1.9 V
|
Supply Voltage-Nom
|
2 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1.27 mm
|
Terminal Position
|
BOTTOM
|
Width
|
25 mm
|
uPs/uCs/Peripheral ICs Type
|
MICROPROCESSOR, RISC
|
Alternate Parts for XPC755BRX400LE
This table gives cross-reference parts and alternative options found for XPC755BRX400LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XPC755BRX400LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
PC755VGHU400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 | Teledyne e2v | XPC755BRX400LE vs PC755VGHU400LE |
XPC755BPX400LER2 | 32-BIT, 400MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360 | Motorola Mobility LLC | XPC755BRX400LE vs XPC755BPX400LER2 |
MPC755CPX400 | 32-BIT, 400MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-360 | Freescale Semiconductor | XPC755BRX400LE vs MPC755CPX400 |
PC755BVZFU400LD | RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360 | Teledyne e2v | XPC755BRX400LE vs PC755BVZFU400LD |
PC755MG400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | XPC755BRX400LE vs PC755MG400LE |
XPC755BRX400TE | 32-BIT, 400MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FCBGA-360 | Freescale Semiconductor | XPC755BRX400LE vs XPC755BRX400TE |
PC755VG400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Teledyne e2v | XPC755BRX400LE vs PC755VG400LE |
PCX755BMZFU400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360 | Atmel Corporation | XPC755BRX400LE vs PCX755BMZFU400LE |
MPC755CPX400LE | 360PBGA, RV2.8, 4A, 105C. HIP4 | Freescale Semiconductor | XPC755BRX400LE vs MPC755CPX400LE |
PC755BVGU400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Atmel Corporation | XPC755BRX400LE vs PC755BVGU400LE |