-
Part Symbol
-
Footprint
-
3D Model
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
Part Details for XCZU9CG-1FFVC900E by AMD
Overview of XCZU9CG-1FFVC900E by AMD
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for XCZU9CG-1FFVC900E
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
122-2034-ND
|
DigiKey | IC SOC CORTEX-A53 900FCBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray |
2 In Stock |
|
$2,916.2500 | Buy Now |
|
DISTI #
XCZU9CG-1FFVC900E
|
Avnet Americas | FPGA Zynq UltraScale+ Family 599550 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray - Trays (Alt: XCZU9CG-1FFVC900E) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
|
$2,951.2450 | Buy Now |
|
DISTI #
217-CZU9CG-1FFVC900E
|
Mouser Electronics | SoC FPGA XCZU9CG-1FFVC900E RoHS: Compliant | 3 |
|
$2,869.2600 | Buy Now |
Part Details for XCZU9CG-1FFVC900E
XCZU9CG-1FFVC900E CAD Models
XCZU9CG-1FFVC900E Part Data Attributes
|
|
XCZU9CG-1FFVC900E
AMD
Buy Now
Datasheet
|
Compare Parts:
XCZU9CG-1FFVC900E
AMD
Microprocessor Circuit, CMOS, PBGA900, FCBGA-900
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | FCBGA-900 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 16 Weeks | |
| Samacsys Manufacturer | AMD | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Number of Terminals | 900 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Supply Voltage-Max | 0.876 V | |
| Supply Voltage-Min | 0.825 V | |
| Supply Voltage-Nom | 0.85 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |