There are no models available for this part yet.
Overview of XCZU5EG-1FBVB900I by AMD
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 3 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for XCZU5EG-1FBVB900I by AMD
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
XCZU5EG-1FBVB900I-ND
|
DigiKey | IC SOC CORTEX-A53 900FCBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
|
$2,870.0000 | Buy Now | |
DISTI #
XCZU5EG-1FBVB900I
|
Avnet Americas | FPGA Zynq UltraScale+ Family 256200 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray - Trays (Alt: XCZU5EG-1FBVB900I) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
|
$2,904.4400 | Buy Now | |
DISTI #
217-CZU5EG-1FBVB900I
|
Mouser Electronics | SoC FPGA XCZU5EG-1FBVB900I RoHS: Compliant | 0 |
|
$2,823.7600 | Order Now |
CAD Models for XCZU5EG-1FBVB900I by AMD
Part Data Attributes for XCZU5EG-1FBVB900I by AMD
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
ADVANCED MICRO DEVICES INC
|
Reach Compliance Code
|
compliant
|
Factory Lead Time
|
16 Weeks
|
Samacsys Manufacturer
|
AMD
|
JESD-30 Code
|
R-PBGA-B900
|
JESD-609 Code
|
e1
|
Length
|
31 mm
|
Moisture Sensitivity Level
|
4
|
Number of Terminals
|
900
|
Operating Temperature-Max
|
100 °C
|
Operating Temperature-Min
|
-40 °C
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
BGA
|
Package Equivalence Code
|
BGA900,30X30,40
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY
|
Peak Reflow Temperature (Cel)
|
245
|
Seated Height-Max
|
2.88 mm
|
Supply Voltage-Max
|
0.876 V
|
Supply Voltage-Min
|
0.825 V
|
Supply Voltage-Nom
|
0.85 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Finish
|
TIN SILVER COPPER
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
Width
|
31 mm
|
uPs/uCs/Peripheral ICs Type
|
PROGRAMMABLE SoC
|
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