Part Details for XCZU4EV-2SFVC784E by AMD
Overview of XCZU4EV-2SFVC784E by AMD
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for XCZU4EV-2SFVC784E
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
65AC4247
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Newark | Mpsoc, Arm Cortex-A53/R5, Fcbga-784, Product Range:Zynq Family Ultrascale+ Series Microprocessors, Cpu Speed:1.5Ghz, Core Architecture:Arm Cortex-A53, Arm Cortex-R5, Mpu Case Style:Fcbga, No. Of Pins:784Pins, Mpu Family:Zynq, Mpu Rohs Compliant: Yes |Amd XCZU4EV-2SFVC784E RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 0 |
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$1,723.7500 | Buy Now |
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DISTI #
XCZU4EV-2SFVC784E-ND
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DigiKey | IC SOC CORTEX-A53 784FCBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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$1,723.7500 | Buy Now |
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DISTI #
XCZU4EV-2SFVC784E
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Avnet Americas | FPGA Zynq UltraScale+ 192150 Cells 20nm Technology 0.85V 784-Pin FCBGA Tray - Trays (Alt: XCZU4EV-2SFVC784E) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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RFQ | |
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DISTI #
217-CZU4EV-2SFVC784E
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Mouser Electronics | SoC FPGA XCZU4EV-2SFVC784E RoHS: Compliant | 0 |
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$1,792.5300 | Order Now |
Part Details for XCZU4EV-2SFVC784E
XCZU4EV-2SFVC784E CAD Models
XCZU4EV-2SFVC784E Part Data Attributes
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XCZU4EV-2SFVC784E
AMD
Buy Now
Datasheet
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Compare Parts:
XCZU4EV-2SFVC784E
AMD
Microprocessor Circuit, CMOS, PBGA784, FCBGA-784
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | FCBGA-784 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 16 Weeks | |
| Samacsys Manufacturer | AMD | |
| JESD-30 Code | S-PBGA-B784 | |
| JESD-609 Code | e1 | |
| Length | 23 mm | |
| Moisture Sensitivity Level | 4 | |
| Number of Terminals | 784 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 250 | |
| Seated Height-Max | 3.32 mm | |
| Supply Voltage-Max | 0.876 V | |
| Supply Voltage-Min | 0.825 V | |
| Supply Voltage-Nom | 0.85 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 23 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |