Part Details for XCZU4EV-1SFVC784E by AMD Xilinx
Overview of XCZU4EV-1SFVC784E by AMD Xilinx
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for XCZU4EV-1SFVC784E
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
|
MacroQuest Electronics | FPGA Zynq UltraScale+ 192150 Cells 20nm Technology 0.85V 784-Pin FCBGA Tray - Trays | 160 |
|
$906.4600 / $1,280.5000 | Buy Now |
Part Details for XCZU4EV-1SFVC784E
XCZU4EV-1SFVC784E CAD Models
XCZU4EV-1SFVC784E Part Data Attributes
|
XCZU4EV-1SFVC784E
AMD Xilinx
Buy Now
Datasheet
|
Compare Parts:
XCZU4EV-1SFVC784E
AMD Xilinx
Microprocessor Circuit, CMOS, PBGA784, FLIPCHIP-784
|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | XILINX INC | |
Package Description | FBGA, BGA78428X28,32 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 | |
Factory Lead Time | 52 Weeks | |
JESD-30 Code | R-PBGA-B784 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Number of Terminals | 784 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 250 | |
Supply Voltage-Max | 0.876 V | |
Supply Voltage-Min | 0.825 V | |
Supply Voltage-Nom | 0.85 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |