Datasheets
XCZU4EV-1SFVC784E by:

Microprocessor Circuit, CMOS, PBGA784, FLIPCHIP-784

Part Details for XCZU4EV-1SFVC784E by AMD Xilinx

Overview of XCZU4EV-1SFVC784E by AMD Xilinx

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Price & Stock for XCZU4EV-1SFVC784E

Part # Distributor Description Stock Price Buy
MacroQuest Electronics FPGA Zynq UltraScale+ 192150 Cells 20nm Technology 0.85V 784-Pin FCBGA Tray - Trays 160
  • 1 $1,280.5000
  • 60 $1,093.4800
  • 300 $906.4600
$906.4600 / $1,280.5000 Buy Now

Part Details for XCZU4EV-1SFVC784E

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XCZU4EV-1SFVC784E Part Data Attributes

XCZU4EV-1SFVC784E AMD Xilinx
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XCZU4EV-1SFVC784E AMD Xilinx Microprocessor Circuit, CMOS, PBGA784, FLIPCHIP-784
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Package Description FBGA, BGA78428X28,32
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01
Factory Lead Time 52 Weeks
JESD-30 Code R-PBGA-B784
JESD-609 Code e1
Moisture Sensitivity Level 4
Number of Terminals 784
Operating Temperature-Max 100 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 250
Supply Voltage-Max 0.876 V
Supply Voltage-Min 0.825 V
Supply Voltage-Nom 0.85 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT

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