Part Details for XCZU4CG-1FBVB900I by AMD Xilinx
Overview of XCZU4CG-1FBVB900I by AMD Xilinx
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Industrial Automation
Electronic Manufacturing
Price & Stock for XCZU4CG-1FBVB900I
Part # | Distributor | Description | Stock | Price | Buy | |
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MacroQuest Electronics | FPGA Zynq UltraScale+ Family 192150 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray - Trays | 500 |
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$1,195.4800 / $1,566.5700 | Buy Now |
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Win Source Electronics | IC SOC CORTEX-A53 900FCBGA / Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 192K+ Logic Cells 500MHz, 1.2GHz 900-FCBGA (31x31) | 2000 |
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$150.7250 / $168.1160 | Buy Now |
Part Details for XCZU4CG-1FBVB900I
XCZU4CG-1FBVB900I CAD Models
XCZU4CG-1FBVB900I Part Data Attributes:
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XCZU4CG-1FBVB900I
AMD Xilinx
Buy Now
Datasheet
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Compare Parts:
XCZU4CG-1FBVB900I
AMD Xilinx
Microprocessor Circuit, CMOS, PBGA900, FLIPCHIP-900
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | XILINX INC | |
Package Description | FCBGA-900 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 | |
Factory Lead Time | 52 Weeks | |
JESD-30 Code | R-PBGA-B900 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Number of Terminals | 900 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 245 | |
Supply Voltage-Max | 0.876 V | |
Supply Voltage-Min | 0.825 V | |
Supply Voltage-Nom | 0.85 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |