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CMOS, PBGA1517,
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XCZU47DR-2FSVG1517I by AMD is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
122-XCZU47DR-2FSVG1517I-ND
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DigiKey | IC ZUP RFSOC A53 FPGA 1517BGA Min Qty: 1 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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$29,203.7500 | Buy Now |
DISTI #
XCZU47DR-2FSVG1517I
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Avnet Americas | SoC 64-Bit ARM Cortex-A53/ARM Cortex-R5 RISC 1333MHz/533MHz 6Core 1517-Pin FCBGA - Trays (Alt: XCZU4... more RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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RFQ | |
DISTI #
XCZU47DR-2FSVG1517I
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Avnet Silica | SoC 64Bit ARM CortexA53ARM CortexR5 RISC 1333MHz533MHz 6Core 1517Pin FCBGA (Alt: XCZU47DR-2FSVG1517I... more RoHS: Compliant Min Qty: 1 Package Multiple: 21 Lead time: 17 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
DISTI #
XCZU47DR-2FSVG1517I
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EBV Elektronik | SoC 64Bit ARM CortexA53ARM CortexR5 RISC 1333MHz533MHz 6Core 1517Pin FCBGA (Alt: XCZU47DR-2FSVG1517I... more RoHS: Compliant Min Qty: 1 Package Multiple: 21 Lead time: 18 Weeks, 0 Days | EBV - 0 |
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Buy Now |
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XCZU47DR-2FSVG1517I
AMD
Buy Now
Datasheet
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Compare Parts:
XCZU47DR-2FSVG1517I
AMD
CMOS, PBGA1517,
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Reach Compliance Code | compliant | |
Factory Lead Time | 16 Weeks | |
Samacsys Manufacturer | AMD | |
JESD-30 Code | R-PBGA-B1517 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Number of Terminals | 1517 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 240 | |
Supply Voltage-Max | 0.876 V | |
Supply Voltage-Min | 0.825 V | |
Supply Voltage-Nom | 0.85 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
uPs/uCs/Peripheral ICs Type | RFSOC |