Part Details for XCZU47DR-1FSVE1156E by AMD
Overview of XCZU47DR-1FSVE1156E by AMD
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for XCZU47DR-1FSVE1156E
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
122-XCZU47DR-1FSVE1156E-ND
|
DigiKey | IC ZUP RFSOC A53 FPGA 1156BGA Min Qty: 1 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
|
$15,906.2500 | Buy Now |
Part Details for XCZU47DR-1FSVE1156E
XCZU47DR-1FSVE1156E CAD Models
XCZU47DR-1FSVE1156E Part Data Attributes
|
XCZU47DR-1FSVE1156E
AMD
Buy Now
Datasheet
|
Compare Parts:
XCZU47DR-1FSVE1156E
AMD
CMOS, PBGA1156,
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Reach Compliance Code | compliant | |
JESD-30 Code | R-PBGA-B1156 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Number of Terminals | 1156 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 240 | |
Supply Voltage-Max | 0.876 V | |
Supply Voltage-Min | 0.825 V | |
Supply Voltage-Nom | 0.85 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
uPs/uCs/Peripheral ICs Type | RFSOC |