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Microcontrollers and Processors / Other uPs/uCs/Peripheral ICs / XCZU27DR-2FFVE1156I
Datasheets
XCZU27DR-2FFVE1156I by:
AMD Xilinx
AMD
AMD Xilinx
Honest Han
Not Found

Microprocessor Circuit,

Part Details for XCZU27DR-2FFVE1156I by AMD Xilinx

Results Overview of XCZU27DR-2FFVE1156I by AMD Xilinx

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Applications Security and Surveillance Virtual Reality (VR), Augmented Reality (AR), and Vision Systems

XCZU27DR-2FFVE1156I Information

XCZU27DR-2FFVE1156I by AMD Xilinx is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for XCZU27DR-2FFVE1156I

Part # Distributor Description Stock Price Buy
DISTI # SMC-XCZU27DR-2FFVE1156I
Sensible Micro Corporation AS6081 Certified Vendor, 1 Yr Warranty RoHS: Not Compliant Min Qty: 25 Lead time: 2 Weeks, 0 Days 6500
RFQ
Vyrian Peripheral ICs 401
RFQ
Win Source Electronics FPGA Zynq UltraScale+ 930300 Cells 775MHz 16nm 0.85V 1156-Ball BGA 860
  • 1 $394.2858
$394.2858 Buy Now

Part Details for XCZU27DR-2FFVE1156I

XCZU27DR-2FFVE1156I CAD Models

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XCZU27DR-2FFVE1156I Part Data Attributes

Parametric Data
XCZU27DR-2FFVE1156I AMD Xilinx
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Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01
Date Of Intro 2017-12-19

XCZU27DR-2FFVE1156I Frequently Asked Questions (FAQ)

  • The maximum power consumption of XCZU27DR-2FFVE1156I is around 12W, but it can vary depending on the specific use case and operating conditions.

  • To optimize power consumption, you can use power-saving features like clock gating, voltage scaling, and dynamic voltage and frequency scaling. Additionally, you can use the Xilinx Power Estimator (XPE) tool to estimate power consumption and identify areas for optimization.

  • The maximum operating temperature of XCZU27DR-2FFVE1156I is 100°C (junction temperature). However, it's recommended to operate the device at a temperature below 85°C for optimal performance and reliability.

  • To ensure signal integrity, you should follow the guidelines provided in the Xilinx Signal Integrity User Guide, including using proper termination, routing, and shielding techniques. Additionally, you can use simulation tools like IBIS-AMI and Sigrity to analyze and optimize signal integrity.

  • The recommended PCB layout and stackup for XCZU27DR-2FFVE1156I can be found in the Xilinx PCB Design Guide, which provides guidelines for layer stackup, routing, and component placement. It's also recommended to use a 4-6 layer PCB with a thickness of 0.8-1.2 mm.