Part Details for XCZU19EG-2FFVC1760I by AMD Xilinx
Overview of XCZU19EG-2FFVC1760I by AMD Xilinx
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for XCZU19EG-2FFVC1760I
Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 25 |
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RFQ | ||
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MacroQuest Electronics | IC SOC CORTEX-A53 1760FCBGA | 210 |
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$8,622.3100 / $10,143.8900 | Buy Now |
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Win Source Electronics | IC SOC CORTEX-A53 1760FCBGA | 150 |
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$705.7143 | Buy Now |
Part Details for XCZU19EG-2FFVC1760I
XCZU19EG-2FFVC1760I CAD Models
XCZU19EG-2FFVC1760I Part Data Attributes
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XCZU19EG-2FFVC1760I
AMD Xilinx
Buy Now
Datasheet
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Compare Parts:
XCZU19EG-2FFVC1760I
AMD Xilinx
Microprocessor Circuit, CMOS, PBGA1760, FLIPCHIP-1760
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | XILINX INC | |
Package Description | FCBGA-1760 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 | |
Factory Lead Time | 52 Weeks | |
JESD-30 Code | R-PBGA-B1760 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Number of Terminals | 1760 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 245 | |
Supply Voltage-Max | 0.876 V | |
Supply Voltage-Min | 0.825 V | |
Supply Voltage-Nom | 0.85 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |