Datasheets
XCZU19EG-1FFVC1760E by:

Microprocessor Circuit, CMOS, PBGA1760, FCBGA-1760

Part Details for XCZU19EG-1FFVC1760E by AMD

Overview of XCZU19EG-1FFVC1760E by AMD

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Price & Stock for XCZU19EG-1FFVC1760E

Part # Distributor Description Stock Price Buy
DISTI # XCZU19EG-1FFVC1760E-ND
DigiKey IC SOC CORTEX-A53 1760FCBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray Temporarily Out of Stock
  • 1 $6,443.7500
$6,443.7500 Buy Now
DISTI # XCZU19EG-1FFVC1760
Avnet Americas FPGA Zynq UltraScale+ Family 1143450 Cells 20nm Technology 0.85V 1760-Pin FCBGA Tray - Trays (Alt: XCZU19EG-1FFVC1760) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray 0
RFQ
DISTI # 217-U19EG-1FFVC1760E
Mouser Electronics SoC FPGA XCZU19EG-1FFVC1760E RoHS: Compliant 0
  • 1 $6,339.9300
$6,339.9300 Order Now

Part Details for XCZU19EG-1FFVC1760E

XCZU19EG-1FFVC1760E CAD Models

XCZU19EG-1FFVC1760E Part Data Attributes

XCZU19EG-1FFVC1760E AMD
Buy Now Datasheet
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XCZU19EG-1FFVC1760E AMD Microprocessor Circuit, CMOS, PBGA1760, FCBGA-1760
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Package Description FCBGA-1760
Reach Compliance Code compliant
Factory Lead Time 16 Weeks
Samacsys Manufacturer AMD
JESD-30 Code R-PBGA-B1760
JESD-609 Code e1
Moisture Sensitivity Level 4
Number of Terminals 1760
Operating Temperature-Max 100 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Supply Voltage-Max 0.876 V
Supply Voltage-Min 0.825 V
Supply Voltage-Nom 0.85 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT

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