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Microprocessor Circuit, CMOS, PBGA1760, FCBGA-1760
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Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
XCZU19EG-1FFVC1760E-ND
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DigiKey | IC SOC CORTEX-A53 1760FCBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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$6,443.7500 | Buy Now |
DISTI #
XCZU19EG-1FFVC1760
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Avnet Americas | FPGA Zynq UltraScale+ Family 1143450 Cells 20nm Technology 0.85V 1760-Pin FCBGA Tray - Trays (Alt: XCZU19EG-1FFVC1760) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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RFQ | |
DISTI #
217-U19EG-1FFVC1760E
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Mouser Electronics | SoC FPGA XCZU19EG-1FFVC1760E RoHS: Compliant | 0 |
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$6,339.9300 | Order Now |
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XCZU19EG-1FFVC1760E
AMD
Buy Now
Datasheet
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Compare Parts:
XCZU19EG-1FFVC1760E
AMD
Microprocessor Circuit, CMOS, PBGA1760, FCBGA-1760
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Package Description | FCBGA-1760 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 16 Weeks | |
Samacsys Manufacturer | AMD | |
JESD-30 Code | R-PBGA-B1760 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Number of Terminals | 1760 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Supply Voltage-Max | 0.876 V | |
Supply Voltage-Min | 0.825 V | |
Supply Voltage-Nom | 0.85 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |