Part Details for XCZU17EG-2FFVE1924E by AMD Xilinx
Overview of XCZU17EG-2FFVE1924E by AMD Xilinx
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Part Details for XCZU17EG-2FFVE1924E
XCZU17EG-2FFVE1924E CAD Models
XCZU17EG-2FFVE1924E Part Data Attributes
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XCZU17EG-2FFVE1924E
AMD Xilinx
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Datasheet
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XCZU17EG-2FFVE1924E
AMD Xilinx
Microprocessor Circuit, CMOS, PBGA1924, FCBGA-1924
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-1924 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 52 Weeks | |
| Date Of Intro | 2017-02-15 | |
| JESD-30 Code | S-PBGA-B1924 | |
| JESD-609 Code | e1 | |
| Length | 45 mm | |
| Moisture Sensitivity Level | 4 | |
| Number of Terminals | 1924 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Seated Height-Max | 3.71 mm | |
| Supply Voltage-Max | 0.876 V | |
| Supply Voltage-Min | 0.825 V | |
| Supply Voltage-Nom | 0.85 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 45 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |