There are no models available for this part yet.
Overview of XCZU11EG-L2FFVC1760E by AMD
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 3 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for XCZU11EG-L2FFVC1760E by AMD
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
XCZU11EG-L2FFVC1760E-ND
|
DigiKey | IC SOC CORTEX-A53 1760FCBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
|
$8,273.7500 | Buy Now | |
DISTI #
XCZU11EG-L2FFVC176
|
Avnet Americas | FPGA Zynq UltraScale+ Family 653100 Cells 20nm Technology 0.85V 1760-Pin FCBGA Tray - Trays (Alt: XCZU11EG-L2FFVC176) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
|
RFQ | ||
DISTI #
217-11EG-L2FFVC1760E
|
Mouser Electronics | SoC FPGA XCZU11EG-L2FFVC1760E RoHS: Compliant | 0 |
|
$8,140.4500 | Order Now |
CAD Models for XCZU11EG-L2FFVC1760E by AMD
Part Data Attributes for XCZU11EG-L2FFVC1760E by AMD
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
ADVANCED MICRO DEVICES INC
|
Package Description
|
FCBGA-1760
|
Reach Compliance Code
|
compliant
|
Factory Lead Time
|
16 Weeks
|
Samacsys Manufacturer
|
AMD
|
Additional Feature
|
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
|
JESD-30 Code
|
R-PBGA-B1760
|
JESD-609 Code
|
e1
|
Moisture Sensitivity Level
|
4
|
Number of Terminals
|
1760
|
Operating Temperature-Max
|
110 °C
|
Operating Temperature-Min
|
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
BGA
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY
|
Supply Voltage-Max
|
0.742 V
|
Supply Voltage-Min
|
0.698 V
|
Supply Voltage-Nom
|
0.72 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
OTHER
|
Terminal Finish
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form
|
BALL
|
Terminal Position
|
BOTTOM
|
uPs/uCs/Peripheral ICs Type
|
MICROPROCESSOR CIRCUIT
|
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