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Microcontrollers and Processors / Other uPs/uCs/Peripheral ICs / XCZU11EG-L1FFVC1156I
Datasheets
XCZU11EG-L1FFVC1156I by:
AMD Xilinx
AMD
AMD Xilinx
Not Found

Microprocessor Circuit, CMOS, PBGA1156, FLIPCHIP-1156

Part Details for XCZU11EG-L1FFVC1156I by AMD Xilinx

Results Overview of XCZU11EG-L1FFVC1156I by AMD Xilinx

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XCZU11EG-L1FFVC1156I Information

XCZU11EG-L1FFVC1156I by AMD Xilinx is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for XCZU11EG-L1FFVC1156I

Part # Distributor Description Stock Price Buy
MacroQuest Electronics ISO 9001: 2015, ISO 14001:2015, ISO 45001:2018 200 STOCK
RFQ

Part Details for XCZU11EG-L1FFVC1156I

XCZU11EG-L1FFVC1156I CAD Models

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XCZU11EG-L1FFVC1156I Part Data Attributes

Parametric Data
XCZU11EG-L1FFVC1156I AMD Xilinx
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XCZU11EG-L1FFVC1156I AMD Xilinx Microprocessor Circuit, CMOS, PBGA1156, FLIPCHIP-1156
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Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Package Description FCBGA-1156
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01
Factory Lead Time 52 Weeks
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
JESD-30 Code R-PBGA-B1156
JESD-609 Code e1
Moisture Sensitivity Level 4
Number of Terminals 1156
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 245
Supply Voltage-Max 0.742 V
Supply Voltage-Min 0.698 V
Supply Voltage-Nom 0.72 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT

XCZU11EG-L1FFVC1156I Related Parts

XCZU11EG-L1FFVC1156I Frequently Asked Questions (FAQ)

  • The maximum power consumption of XCZU11EG-L1FFVC1156I is around 12W, but it can vary depending on the usage and configuration of the device.

  • To optimize power consumption, you can use power-saving features like clock gating, voltage scaling, and dynamic voltage and frequency scaling. You can also use the Xilinx Power Estimator (XPE) tool to estimate and optimize power consumption.

  • The maximum operating temperature of XCZU11EG-L1FFVC1156I is 100°C (junction temperature) and 85°C (ambient temperature).

  • To ensure signal integrity, you can use techniques like signal buffering, termination, and routing optimization. You can also use the Xilinx Vivado Design Suite to analyze and optimize signal integrity.

  • The maximum bandwidth of the PCIe interface in XCZU11EG-L1FFVC1156I is 16 GT/s (gigatransfers per second) per lane, with a maximum of 16 lanes.