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Programmable Logic / Field Programmable Gate Arrays / XCVU31P-1FSVH1924E
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XCVU31P-1FSVH1924E by:
AMD Xilinx
AMD
AMD Xilinx
Not Found

Field Programmable Gate Array,

Part Details for XCVU31P-1FSVH1924E by AMD Xilinx

Results Overview of XCVU31P-1FSVH1924E by AMD Xilinx

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Applications Education and Research Computing and Data Storage Telecommunications

XCVU31P-1FSVH1924E Information

XCVU31P-1FSVH1924E by AMD Xilinx is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.

Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.

Price & Stock for XCVU31P-1FSVH1924E

Part # Distributor Description Stock Price Buy
Vyrian Programmable ICs 955
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Part Details for XCVU31P-1FSVH1924E

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XCVU31P-1FSVH1924E Part Data Attributes

Parametric Data
XCVU31P-1FSVH1924E AMD Xilinx
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Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Reach Compliance Code compliant
ECCN Code 3A001.A.7.B
HTS Code 8542.39.00.01
Date Of Intro 2017-02-15
JESD-30 Code S-PBGA-B1924
JESD-609 Code e1
Length 45 mm
Moisture Sensitivity Level 4
Number of CLBs 54960
Number of Inputs 208
Number of Logic Cells 961800
Number of Outputs 208
Number of Terminals 1924
Operating Temperature-Max 100 °C
Operating Temperature-Min
Organization 54960 CLBS
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1924,44X44,40
Package Shape SQUARE
Package Style GRID ARRAY
Packing Method BOX; TRAY
Peak Reflow Temperature (Cel) 240
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 4.51 mm
Supply Voltage-Max 0.876 V
Supply Voltage-Min 0.825 V
Supply Voltage-Nom 0.85 V
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 45 mm

XCVU31P-1FSVH1924E Related Parts

XCVU31P-1FSVH1924E Frequently Asked Questions (FAQ)

  • Xilinx provides a PCB design guide and layout recommendations in the UG583 document, which includes guidelines for signal integrity, power distribution, and thermal management.

  • Xilinx provides a power estimation tool, XPE, which can help estimate power consumption based on the design. Additionally, the UG570 document provides guidelines for power optimization techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.

  • The XCVU31P-1FSVH1924E has a maximum junction temperature of 100°C. Xilinx recommends using a heat sink or thermal interface material to ensure proper thermal management. The UG583 document provides thermal management guidelines and recommendations.

  • Xilinx recommends using a secure boot mechanism, such as the Boot Header feature, to ensure reliable configuration and boot of the FPGA. Additionally, the UG570 document provides guidelines for configuring the FPGA's boot mode and using the FPGA's built-in self-test features.

  • The XCVU31P-1FSVH1924E has high-speed transceivers that can operate up to 32.75 Gbps. However, there are limitations and considerations for using these transceivers, such as signal integrity, jitter, and equalization. Xilinx provides guidelines and recommendations for using the high-speed transceivers in the UG578 document.