There are no models available for this part yet.
Overview of XCVU095-1FFVB1760C by AMD
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for XCVU095-1FFVB1760C by AMD
Part Data Attributes for XCVU095-1FFVB1760C by AMD
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Rohs Code
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Yes
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Part Life Cycle Code
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Active
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Ihs Manufacturer
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ADVANCED MICRO DEVICES INC
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Package Description
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FBGA-1760
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Reach Compliance Code
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compliant
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JESD-30 Code
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S-PBGA-B1760
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JESD-609 Code
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e1
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Length
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42.5 mm
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Moisture Sensitivity Level
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4
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Number of CLBs
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67200
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Number of Inputs
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832
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Number of Logic Cells
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1176000
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Number of Outputs
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832
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Number of Terminals
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1760
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Operating Temperature-Max
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85 °C
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Operating Temperature-Min
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Organization
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67200 CLBS
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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BGA
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Package Equivalence Code
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BGA1760,42X42,40
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Package Shape
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SQUARE
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Package Style
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GRID ARRAY
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Peak Reflow Temperature (Cel)
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245
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Programmable Logic Type
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FIELD PROGRAMMABLE GATE ARRAY
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Seated Height-Max
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3.71 mm
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Supply Voltage-Max
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0.979 V
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Supply Voltage-Min
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0.922 V
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Supply Voltage-Nom
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0.95 V
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Surface Mount
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YES
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Temperature Grade
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OTHER
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Terminal Finish
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TIN SILVER COPPER
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Terminal Form
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BALL
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Terminal Pitch
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1 mm
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Terminal Position
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BOTTOM
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Time@Peak Reflow Temperature-Max (s)
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30
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Width
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42.5 mm
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