Datasheets
XCVC1902-2MSIVSVD1760 by:
AMD
AMD
AMD Xilinx
Not Found

Microprocessor Circuit, CMOS, PBGA1760, FCBGA-1760

Part Details for XCVC1902-2MSIVSVD1760 by AMD

Results Overview of XCVC1902-2MSIVSVD1760 by AMD

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

XCVC1902-2MSIVSVD1760 Information

XCVC1902-2MSIVSVD1760 by AMD is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for XCVC1902-2MSIVSVD1760

Part # Distributor Description Stock Price Buy
DISTI # 122-XCVC1902-2MSIVSVD1760-ND
DigiKey IC VERSAL AICORE FPGA 1760BGA Min Qty: 1 Lead time: 18 Weeks Container: Tray Temporarily Out of Stock
  • 1 $35,807.5000
$35,807.5000 Buy Now
DISTI # XCVC1902-2MSIVSVD1760
Avnet Americas Adaptive Compute Acceleration Platform, Versal VC1902, 800 mV, 1760-Pin, BGA - Bulk (Alt: XCVC1902-2... MSIVSVD1760) more RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 36 Weeks, 0 Days Container: Bulk 47
RFQ

Part Details for XCVC1902-2MSIVSVD1760

XCVC1902-2MSIVSVD1760 CAD Models

There are no models available for this part yet.

Sign in to request this CAD model.

Register or Sign In

XCVC1902-2MSIVSVD1760 Part Data Attributes

XCVC1902-2MSIVSVD1760 AMD
Buy Now Datasheet
Compare Parts:
XCVC1902-2MSIVSVD1760 AMD Microprocessor Circuit, CMOS, PBGA1760, FCBGA-1760
Select a part to compare:
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Package Description FCBGA-1760
Reach Compliance Code compliant
Factory Lead Time 36 Weeks
JESD-30 Code S-PBGA-B1760
Length 40 mm
Number of Terminals 1760
Operating Temperature-Max 110 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code HBGA
Package Equivalence Code BGA1760,42X42,36
Package Shape SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG
Seated Height-Max 4 mm
Supply Voltage-Max 0.825 V
Supply Voltage-Min 0.775 V
Supply Voltage-Nom 0.8 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 0.92 mm
Terminal Position BOTTOM
Width 40 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT