Datasheets
XCVC1502-1LSENSVG1369 by:

Microprocessor Circuit, CMOS, PBGA1369, FCBGA-1369

Part Details for XCVC1502-1LSENSVG1369 by AMD

Overview of XCVC1502-1LSENSVG1369 by AMD

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Price & Stock for XCVC1502-1LSENSVG1369

Part # Distributor Description Stock Price Buy
DISTI # 122-XCVC1502-1LSENSVG1369-ND
DigiKey IC VERSAL AI-CORE FPGA 1369BGA Min Qty: 1 Lead time: 16 Weeks Container: Tray Temporarily Out of Stock
  • 1 $16,641.2500
$16,641.2500 Buy Now
DISTI # XCVC1502-1LSENSVG1
Avnet Americas Advanced Compute Acceleration Platform 680MHz 0.7V 1369-Pin FPBGA Tray/Box - Bulk (Alt: XCVC1502-1LSENSVG1) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Bulk 0
RFQ
DISTI # 217-15021LSENSVG1369
Mouser Electronics SoC FPGA XCVC1502-1LSENSVG1369 RoHS: Compliant 0
  • 1 $16,373.1300
$16,373.1300 Order Now

Part Details for XCVC1502-1LSENSVG1369

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XCVC1502-1LSENSVG1369 Part Data Attributes

XCVC1502-1LSENSVG1369 AMD
Buy Now Datasheet
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XCVC1502-1LSENSVG1369 AMD Microprocessor Circuit, CMOS, PBGA1369, FCBGA-1369
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Package Description FCBGA-1369
Reach Compliance Code compliant
Factory Lead Time 16 Weeks
JESD-30 Code S-PBGA-B1369
Length 35 mm
Number of Terminals 1369
Operating Temperature-Max 100 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY
Package Code HBGA
Package Equivalence Code BGA1369,37X37,36
Package Shape SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG
Seated Height-Max 4 mm
Supply Voltage-Max 0.724 V
Supply Voltage-Min 0.676 V
Supply Voltage-Nom 0.7 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 0.92 mm
Terminal Position BOTTOM
Width 35 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT

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