Datasheets
XCV200E-6FG456C by: AMD Xilinx

Field Programmable Gate Array, 1176 CLBs, 63504 Gates, 357MHz, 5292-Cell, CMOS, PBGA456, FBGA-456

Part Details for XCV200E-6FG456C by AMD Xilinx

Results Overview of XCV200E-6FG456C by AMD Xilinx

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Applications Computing and Data Storage

XCV200E-6FG456C Information

XCV200E-6FG456C by AMD Xilinx is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.

Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.

Price & Stock for XCV200E-6FG456C

Part # Distributor Description Stock Price Buy
Bristol Electronics   3
RFQ
Quest Components FPGA, 1176 CLBS, 63504 GATES, 357 MHz, PBGA456 7
  • 1 $58.5000
$58.5000 Buy Now
Quest Components FPGA, 1176 CLBS, 63504 GATES, 357 MHz, PBGA456 6
  • 1 $140.0000
  • 3 $133.0000
  • 5 $126.0000
$126.0000 / $140.0000 Buy Now
Quest Components FPGA, 1176 CLBS, 63504 GATES, 357 MHz, PBGA456 4
  • 1 $91.0000
$91.0000 Buy Now
Quest Components FPGA, 1176 CLBS, 63504 GATES, 357 MHz, PBGA456 4
  • 1 $140.0000
  • 3 $133.0000
  • 5 $126.0000
$126.0000 / $140.0000 Buy Now
Quest Components FPGA, 1176 CLBS, 63504 GATES, 357 MHz, PBGA456 1
  • 1 $91.0000
$91.0000 Buy Now
Quest Components FPGA, 1176 CLBS, 63504 GATES, 357 MHz, PBGA456 1
  • 1 $159.1200
$159.1200 Buy Now
NexGen Digital   59
RFQ
Chip 1 Exchange INSTOCK 3
RFQ

Part Details for XCV200E-6FG456C

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XCV200E-6FG456C Part Data Attributes

XCV200E-6FG456C AMD Xilinx
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XCV200E-6FG456C AMD Xilinx Field Programmable Gate Array, 1176 CLBs, 63504 Gates, 357MHz, 5292-Cell, CMOS, PBGA456, FBGA-456
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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-456
Pin Count 456
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01
Clock Frequency-Max 357 MHz
Combinatorial Delay of a CLB-Max 0.47 ns
JESD-30 Code S-PBGA-B456
JESD-609 Code e0
Length 23 mm
Moisture Sensitivity Level 3
Number of CLBs 1176
Number of Equivalent Gates 63504
Number of Inputs 284
Number of Logic Cells 5292
Number of Outputs 284
Number of Terminals 456
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 1176 CLBS, 63504 GATES
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA456,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 2.6 mm
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
Supply Voltage-Nom 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 23 mm

Alternate Parts for XCV200E-6FG456C

This table gives cross-reference parts and alternative options found for XCV200E-6FG456C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XCV200E-6FG456C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
XCV200E-6FGG456C AMD Xilinx Check for Price Field Programmable Gate Array, 1176 CLBs, 63504 Gates, 357MHz, 5292-Cell, CMOS, PBGA456, FBGA-456 XCV200E-6FG456C vs XCV200E-6FGG456C
XCV200E-6FG456I AMD Xilinx Check for Price Field Programmable Gate Array, 1176 CLBs, 63504 Gates, 357MHz, 5292-Cell, CMOS, PBGA456, FBGA-456 XCV200E-6FG456C vs XCV200E-6FG456I
XCV200E-6FGG456I AMD Xilinx Check for Price Field Programmable Gate Array, 1176 CLBs, 63504 Gates, 357MHz, 5292-Cell, CMOS, PBGA456, FBGA-456 XCV200E-6FG456C vs XCV200E-6FGG456I
XCV200E-7FG456I AMD Xilinx Check for Price Field Programmable Gate Array, 1176 CLBs, 63504 Gates, 400MHz, 5292-Cell, CMOS, PBGA456, FBGA-456 XCV200E-6FG456C vs XCV200E-7FG456I
XCV200E-7FGG456C AMD Xilinx Check for Price Field Programmable Gate Array, 1176 CLBs, 63504 Gates, 400MHz, 5292-Cell, CMOS, PBGA456, FBGA-456 XCV200E-6FG456C vs XCV200E-7FGG456C
XCV200E-7FGG456I AMD Xilinx Check for Price Field Programmable Gate Array, 1176 CLBs, 63504 Gates, 400MHz, 5292-Cell, CMOS, PBGA456, FBGA-456 XCV200E-6FG456C vs XCV200E-7FGG456I
XCV200E-7FG456C AMD Xilinx Check for Price Field Programmable Gate Array, 1176 CLBs, 63504 Gates, 400MHz, 5292-Cell, CMOS, PBGA456, FBGA-456 XCV200E-6FG456C vs XCV200E-7FG456C
XCV200E-8FGG456C AMD Xilinx Check for Price Field Programmable Gate Array, 1176 CLBs, 63504 Gates, 416MHz, 5292-Cell, CMOS, PBGA456, FBGA-456 XCV200E-6FG456C vs XCV200E-8FGG456C
XCV200E-8FGG456I AMD Xilinx Check for Price Field Programmable Gate Array, 1176 CLBs, 63504 Gates, 416MHz, 5292-Cell, CMOS, PBGA456, FBGA-456 XCV200E-6FG456C vs XCV200E-8FGG456I
XCV200E-8FG456C AMD Xilinx Check for Price Field Programmable Gate Array, 1176 CLBs, 63504 Gates, 416MHz, 5292-Cell, CMOS, PBGA456, FBGA-456 XCV200E-6FG456C vs XCV200E-8FG456C

XCV200E-6FG456C Related Parts

XCV200E-6FG456C Frequently Asked Questions (FAQ)

  • The recommended PCB layout and stackup for the XCV200E-6FG456C can be found in the Xilinx PCB Designer's Guide (UG583) and the Xilinx FPGAs PCB Design and Signal Integrity Guidelines (UG583). These guides provide detailed information on layer stackup, trace routing, and signal integrity considerations.

  • To optimize the power supply design for the XCV200E-6FG456C, refer to the Xilinx Power Estimation and Budgeting Guide (UG440) and the Xilinx Virtex-E FPGA Family Power Management Guide (UG115). These guides provide information on power consumption, power supply requirements, and power management techniques.

  • The XCV200E-6FG456C has a maximum junction temperature of 100°C. To ensure proper thermal management, refer to the Xilinx Thermal Management Guide (UG122) and the Xilinx Virtex-E FPGA Family Thermal Management Guide (UG116). These guides provide information on thermal design considerations, heat sink selection, and thermal interface materials.

  • To implement a reliable and efficient clocking scheme for the XCV200E-6FG456C, refer to the Xilinx Clocking Wizard (UG472) and the Xilinx Virtex-E FPGA Family Clocking Resources User Guide (UG117). These guides provide information on clocking architecture, clock domain crossing, and clock jitter management.

  • The XCV200E-6FG456C can be configured and programmed using the Xilinx Vivado Design Suite, which provides various configuration options such as JTAG, SPI, and BPI. Refer to the Xilinx Vivado Design Suite User Guide (UG903) and the Xilinx Virtex-E FPGA Family Configuration and Programming Guide (UG118) for more information.