Datasheets
XCS40-3BG256C by: AMD Xilinx

Field Programmable Gate Array, 784 CLBs, 13000 Gates, 125MHz, 784-Cell, CMOS, PBGA256, PLASTIC, BGA-256

Part Details for XCS40-3BG256C by AMD Xilinx

Overview of XCS40-3BG256C by AMD Xilinx

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Price & Stock for XCS40-3BG256C

Part # Distributor Description Stock Price Buy
Bristol Electronics   32
RFQ
Quest Components Field-Programmable Gate Array, 784 Cell, 256 Pin, Plastic, BGA 25
  • 1 $136.0000
  • 9 $115.6000
  • 18 $108.8000
$108.8000 / $136.0000 Buy Now
Quest Components Field-Programmable Gate Array, 784 Cell, 256 Pin, Plastic, BGA 10
  • 1 $58.0060
  • 10 $55.7750
$55.7750 / $58.0060 Buy Now
Quest Components Field-Programmable Gate Array, 784 Cell, 256 Pin, Plastic, BGA 8
  • 1 $136.0000
  • 5 $122.4000
  • 9 $115.6000
$115.6000 / $136.0000 Buy Now

Part Details for XCS40-3BG256C

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XCS40-3BG256C Part Data Attributes

XCS40-3BG256C AMD Xilinx
Buy Now Datasheet
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XCS40-3BG256C AMD Xilinx Field Programmable Gate Array, 784 CLBs, 13000 Gates, 125MHz, 784-Cell, CMOS, PBGA256, PLASTIC, BGA-256
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description PLASTIC, BGA-256
Pin Count 256
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
Additional Feature MAXIMUM USABLE GATES 40000
Clock Frequency-Max 125 MHz
Combinatorial Delay of a CLB-Max 1.6 ns
JESD-30 Code S-PBGA-B256
JESD-609 Code e0
Length 27 mm
Moisture Sensitivity Level 3
Number of CLBs 784
Number of Equivalent Gates 13000
Number of Inputs 205
Number of Logic Cells 784
Number of Outputs 205
Number of Terminals 256
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 784 CLBS, 13000 GATES
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,20X20,50
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 2.55 mm
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
Supply Voltage-Nom 5 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 27 mm

Alternate Parts for XCS40-3BG256C

This table gives cross-reference parts and alternative options found for XCS40-3BG256C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XCS40-3BG256C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
XCS40-3BG256I Field Programmable Gate Array, 784 CLBs, 13000 Gates, PBGA256, PLASTIC, BGA-256 AMD Xilinx XCS40-3BG256C vs XCS40-3BG256I
XCS40-3BGG256C Field Programmable Gate Array, 784 CLBs, 13000 Gates, 125MHz, CMOS, PBGA256, PLASTIC, BGA-256 AMD Xilinx XCS40-3BG256C vs XCS40-3BGG256C
Part Number Description Manufacturer Compare
XCS40-4BGG256C Field Programmable Gate Array, 784 CLBs, 13000 Gates, 166MHz, CMOS, PBGA256, PLASTIC, BGA-256 AMD Xilinx XCS40-3BG256C vs XCS40-4BGG256C
XCS30-4BG256C Field Programmable Gate Array, 576 CLBs, 10000 Gates, 166MHz, 576-Cell, CMOS, PBGA256, PLASTIC, BGA-256 AMD Xilinx XCS40-3BG256C vs XCS30-4BG256C
XCS40-3BG256I Field Programmable Gate Array, 784 CLBs, 13000 Gates, PBGA256, PLASTIC, BGA-256 AMD Xilinx XCS40-3BG256C vs XCS40-3BG256I
XCS30-3BGG256I Field Programmable Gate Array, 576 CLBs, 10000 Gates, PBGA256, PLASTIC, BGA-256 AMD Xilinx XCS40-3BG256C vs XCS30-3BGG256I
XCS40-3BGG256C Field Programmable Gate Array, 784 CLBs, 13000 Gates, 125MHz, CMOS, PBGA256, PLASTIC, BGA-256 AMD Xilinx XCS40-3BG256C vs XCS40-3BGG256C
XCS30-3BG256C Field Programmable Gate Array, 576 CLBs, 10000 Gates, 125MHz, 576-Cell, CMOS, PBGA256, PLASTIC, BGA-256 AMD Xilinx XCS40-3BG256C vs XCS30-3BG256C

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