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Programmable Logic / Programmable Logic Devices / XCR3256XL-12FT256C
Datasheets
XCR3256XL-12FT256C by:
AMD Xilinx
AMD
AMD Xilinx
Not Found

EE PLD, 12ns, 256-Cell, CMOS, PBGA256, FBGA-256

Part Details for XCR3256XL-12FT256C by AMD Xilinx

Results Overview of XCR3256XL-12FT256C by AMD Xilinx

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

XCR3256XL-12FT256C Information

XCR3256XL-12FT256C by AMD Xilinx is a Programmable Logic Device.
Programmable Logic Devices are under the broader part category of Programmable Logic Devices.

Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.

Price & Stock for XCR3256XL-12FT256C

Part # Distributor Description Stock Price Buy
Bristol Electronics   450
RFQ
Quest Components   360
  • 1 $87.3440
  • 73 $67.6916
  • 149 $65.5080
$65.5080 / $87.3440 Buy Now
Quest Components   95
  • 1 $87.3440
  • 28 $69.8752
  • 73 $67.6916
$67.6916 / $87.3440 Buy Now

Part Details for XCR3256XL-12FT256C

XCR3256XL-12FT256C CAD Models

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XCR3256XL-12FT256C Part Data Attributes

Parametric Data
XCR3256XL-12FT256C AMD Xilinx
Buy Now Datasheet
Compare Parts:
XCR3256XL-12FT256C AMD Xilinx EE PLD, 12ns, 256-Cell, CMOS, PBGA256, FBGA-256
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Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-256
Pin Count 256
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Factory Lead Time 12 Weeks
Additional Feature YES
Clock Frequency-Max 88 MHz
In-System Programmable YES
JESD-30 Code S-PBGA-B256
JESD-609 Code e0
JTAG BST YES
Length 17 mm
Moisture Sensitivity Level 3
Number of Dedicated Inputs
Number of I/O Lines 164
Number of Macro Cells 256
Number of Terminals 256
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 0 DEDICATED INPUTS, 164 I/O
Output Function MACROCELL
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225
Programmable Logic Type EE PLD
Propagation Delay 12 ns
Qualification Status Not Qualified
Seated Height-Max 1.55 mm
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 17 mm

Alternate Parts for XCR3256XL-12FT256C

This table gives cross-reference parts and alternative options found for XCR3256XL-12FT256C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XCR3256XL-12FT256C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
XCR3256XL-12FTG256C AMD Check for Price EE PLD, 12ns, 256-Cell, CMOS, PBGA256, FBGA-256 XCR3256XL-12FT256C vs XCR3256XL-12FTG256C
Part Number Manufacturer Composite Price Description Compare
XCR3256XL-12FT256C AMD Check for Price EE PLD, 12ns, 256-Cell, CMOS, PBGA256, FBGA-256 XCR3256XL-12FT256C vs XCR3256XL-12FT256C
MACHLV466-15YC Vantis Corporation Check for Price EE PLD, 15ns, 256-Cell, CMOS, PQFP208, XCR3256XL-12FT256C vs MACHLV466-15YC
M5LV-256/160-20YI Vantis Corporation Check for Price EE PLD, 21ns, 256-Cell, CMOS, PQFP208, XCR3256XL-12FT256C vs M5LV-256/160-20YI
LC5256MV-75F256C Lattice Semiconductor Corporation Check for Price EE PLD, 9.5ns, 256-Cell, CMOS, PBGA256, FPBGA-256 XCR3256XL-12FT256C vs LC5256MV-75F256C
M5LV-256/160-15YI Vantis Corporation Check for Price EE PLD, 20ns, 256-Cell, CMOS, PQFP208, XCR3256XL-12FT256C vs M5LV-256/160-15YI
M4LV-256/128-15YC Lattice Semiconductor Corporation Check for Price EE PLD, 15ns, 256-Cell, CMOS, PQFP208, PLASTIC, QFP-208 XCR3256XL-12FT256C vs M4LV-256/128-15YC
M4LV-256/128-14YI Lattice Semiconductor Corporation Check for Price EE PLD, 14ns, 256-Cell, CMOS, PQFP208, PLASTIC, QFP-208 XCR3256XL-12FT256C vs M4LV-256/128-14YI
M4A3-256/128-7FAC Vantis Corporation Check for Price EE PLD, 7.5ns, CMOS, PBGA200, XCR3256XL-12FT256C vs M4A3-256/128-7FAC
M4A3-256/192-10FANI Lattice Semiconductor Corporation Check for Price EE PLD, 10ns, 256-Cell, CMOS, PBGA256, LEAD FREE, FPBGA-256 XCR3256XL-12FT256C vs M4A3-256/192-10FANI
M4A3-256/128-6YC Lattice Semiconductor Corporation Check for Price EE PLD, 6ns, 256-Cell, CMOS, PQFP208, PLASTIC, QFP-208 XCR3256XL-12FT256C vs M4A3-256/128-6YC

XCR3256XL-12FT256C Related Parts

XCR3256XL-12FT256C Frequently Asked Questions (FAQ)

  • The recommended PCB layout and stackup for the XCR3256XL-12FT256C can be found in the Xilinx PCB Designer's Guide (UG583) and the Xilinx Virtex-6 FPGA PCB Design and Pin Planning Guide (UG481). These guides provide detailed information on signal integrity, routing, and layer stackup.

  • The XCR3256XL-12FT256C requires a specific power sequencing and voltage regulation scheme to ensure proper operation. Refer to the Xilinx Virtex-6 FPGA Power Management Guide (UG583) for detailed information on power supply requirements, voltage regulation, and power sequencing.

  • The XCR3256XL-12FT256C has a maximum junction temperature of 100°C. To ensure proper thermal management, refer to the Xilinx Virtex-6 FPGA Thermal Management Guide (UG583) for information on heat sink selection, thermal interface materials, and airflow requirements.

  • The XCR3256XL-12FT256C has a complex clocking architecture that requires careful configuration. Refer to the Xilinx Virtex-6 FPGA Clocking Resources User Guide (UG382) for information on clocking resources, clock domains, and clocking architecture configuration.

  • The XCR3256XL-12FT256C's high-speed transceivers have specific constraints and limitations that must be considered during design. Refer to the Xilinx Virtex-6 FPGA GTX Transceiver User Guide (UG476) for information on transceiver configuration, signal integrity, and channel bonding.