Part Details for XCR3256XL-12CS280C by AMD
Results Overview of XCR3256XL-12CS280C by AMD
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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XCR3256XL-12CS280C Information
XCR3256XL-12CS280C by AMD is a Programmable Logic Device.
Programmable Logic Devices are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XCR3256XL-12CS280C
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
XCR3256XL-12CS280C
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Avnet Silica | (Alt: XCR3256XL-12CS280C) RoHS: Not Compliant Min Qty: 1 Package Multiple: 119 Lead time: 143 Weeks, 0 Days | Silica - 0 |
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Part Details for XCR3256XL-12CS280C
XCR3256XL-12CS280C CAD Models
XCR3256XL-12CS280C Part Data Attributes
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XCR3256XL-12CS280C
AMD
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Datasheet
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Compare Parts:
XCR3256XL-12CS280C
AMD
EE PLD, 12ns, 256-Cell, CMOS, PBGA280, 0.80 MM PITCH, CSP-280
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Package Description | 0.80 MM PITCH, CSP-280 | |
Reach Compliance Code | not_compliant | |
Additional Feature | YES | |
Clock Frequency-Max | 88 MHz | |
In-System Programmable | YES | |
JESD-30 Code | S-PBGA-B280 | |
JESD-609 Code | e0 | |
JTAG BST | YES | |
Length | 16 mm | |
Moisture Sensitivity Level | 3 | |
Number of Dedicated Inputs | ||
Number of I/O Lines | 164 | |
Number of Inputs | 164 | |
Number of Macro Cells | 256 | |
Number of Outputs | 164 | |
Number of Terminals | 280 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 0 DEDICATED INPUTS, 164 I/O | |
Output Function | MACROCELL | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA280,19X19,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 240 | |
Programmable Logic Type | EE PLD | |
Propagation Delay | 12 ns | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.2 mm | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 16 mm |