Datasheets
XCR3256XL-10TQG144I by:
AMD Xilinx
AMD
AMD Xilinx
Not Found

EE PLD, 10ns, 256-Cell, CMOS, PQFP144, LEAD FREE, TQFP-144

Part Details for XCR3256XL-10TQG144I by AMD Xilinx

Results Overview of XCR3256XL-10TQG144I by AMD Xilinx

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XCR3256XL-10TQG144I Information

XCR3256XL-10TQG144I by AMD Xilinx is a Programmable Logic Device.
Programmable Logic Devices are under the broader part category of Programmable Logic Devices.

Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.

Price & Stock for XCR3256XL-10TQG144I

Part # Distributor Description Stock Price Buy
Quest Components EE PLD, 10NS, 256-CELL, CMOS, PQFP144 3
  • 1 $140.0000
  • 3 $133.0000
$133.0000 / $140.0000 Buy Now
NexGen Digital   1
RFQ
Velocity Electronics Our Stock 9
RFQ
LCSC LQFP-144(20x20) Programmable Logic Device (CPLDs/FPGAs) ROHS 5
  • 1 $77.2309
  • 30 $74.9432
$74.9432 / $77.2309 Buy Now
Vyrian Programmable ICs 3
RFQ
Win Source Electronics CPLD CoolRunner XPLA3 Family 6K Gates 256 Macro Cells 105MHz 0.35um Technology 3.3V 144-Pin TQFP / I... C CPLD 256MC 9NS 144TQFP more 3600
  • 2 $45.2083
  • 3 $42.2917
  • 4 $40.8334
  • 6 $37.9167
  • 7 $36.4584
  • 9 $35.0000
$35.0000 / $45.2083 Buy Now

Part Details for XCR3256XL-10TQG144I

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XCR3256XL-10TQG144I Part Data Attributes

XCR3256XL-10TQG144I AMD Xilinx
Buy Now Datasheet
Compare Parts:
XCR3256XL-10TQG144I AMD Xilinx EE PLD, 10ns, 256-Cell, CMOS, PQFP144, LEAD FREE, TQFP-144
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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description LEAD FREE, TQFP-144
Pin Count 144
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Factory Lead Time 30 Weeks
Additional Feature YES
Clock Frequency-Max 105 MHz
In-System Programmable YES
JESD-30 Code S-PQFP-G144
JESD-609 Code e3
JTAG BST YES
Length 20 mm
Moisture Sensitivity Level 3
Number of Dedicated Inputs
Number of I/O Lines 120
Number of Macro Cells 256
Number of Terminals 144
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 0 DEDICATED INPUTS, 120 I/O
Output Function MACROCELL
Package Body Material PLASTIC/EPOXY
Package Code LFQFP
Package Equivalence Code QFP144,.87SQ,20
Package Shape SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Programmable Logic Type EE PLD
Propagation Delay 10 ns
Qualification Status Not Qualified
Seated Height-Max 1.6 mm
Supply Voltage-Max 3.6 V
Supply Voltage-Min 2.7 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 20 mm

Alternate Parts for XCR3256XL-10TQG144I

This table gives cross-reference parts and alternative options found for XCR3256XL-10TQG144I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XCR3256XL-10TQG144I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
XCR3256XL-10TQG144I AMD Check for Price EE PLD, 10ns, 256-Cell, CMOS, PQFP144, LEAD FREE, TQFP-144 XCR3256XL-10TQG144I vs XCR3256XL-10TQG144I
Part Number Manufacturer Composite Price Description Compare
XCR3256XL-10TQ144I AMD Check for Price EE PLD, 10ns, 256-Cell, CMOS, PQFP144, TQFP-144 XCR3256XL-10TQG144I vs XCR3256XL-10TQ144I
M5LV-256/104-12VI Vantis Corporation Check for Price EE PLD, 12ns, 256-Cell, CMOS, PQFP144, XCR3256XL-10TQG144I vs M5LV-256/104-12VI
XCR3256XL-10TQ144C AMD Xilinx Check for Price EE PLD, 10ns, 256-Cell, CMOS, PQFP144, TQFP-144 XCR3256XL-10TQG144I vs XCR3256XL-10TQ144C
M5LV-256/104-5VC Vantis Corporation Check for Price EE PLD, 5.5ns, 256-Cell, CMOS, PQFP144, XCR3256XL-10TQG144I vs M5LV-256/104-5VC
XCR3256XL-12TQ144Q AMD Xilinx Check for Price EE PLD, 12ns, 256-Cell, CMOS, PQFP144, TQFP-144 XCR3256XL-10TQG144I vs XCR3256XL-12TQ144Q
M5LV-256/104-10VI Lattice Semiconductor Corporation Check for Price EE PLD, 10ns, 256-Cell, CMOS, PQFP144, TQFP-144 XCR3256XL-10TQG144I vs M5LV-256/104-10VI
M5LV-256/104-7VC Vantis Corporation Check for Price EE PLD, 7.5ns, 256-Cell, CMOS, PQFP144, XCR3256XL-10TQG144I vs M5LV-256/104-7VC
M5A3-256/104-10VI Lattice Semiconductor Corporation Check for Price EE PLD, 10ns, 256-Cell, CMOS, PQFP144, TQFP-144 XCR3256XL-10TQG144I vs M5A3-256/104-10VI
XCR3256XL-12TQG144I AMD Check for Price EE PLD, 12ns, 256-Cell, CMOS, PQFP144, LEAD FREE, TQFP-144 XCR3256XL-10TQG144I vs XCR3256XL-12TQG144I
XCR3256XL-10TQG144C AMD Check for Price EE PLD, 10ns, 256-Cell, CMOS, PQFP144, LEAD FREE, TQFP-144 XCR3256XL-10TQG144I vs XCR3256XL-10TQG144C

XCR3256XL-10TQG144I Related Parts

XCR3256XL-10TQG144I Frequently Asked Questions (FAQ)

  • The XCR3256XL-10TQG144I has an operating temperature range of -40°C to 100°C.

  • A reliable POR circuit can be implemented using an external resistor-capacitor (RC) network and a voltage supervisor IC. The Xilinx UG570 guide provides more details on implementing a POR circuit.

  • The XCR3256XL-10TQG144I supports multiple clocking schemes, including the use of a single clock source, a clock generator, or a phase-locked loop (PLL). The Xilinx Clocking Wizard tool can help design a suitable clocking scheme.

  • To ensure signal integrity and reduce EMI, follow best practices for PCB design, such as using differential signaling, minimizing trace lengths, and using shielding and grounding techniques. The Xilinx Signal Integrity Guide provides more information.

  • The recommended decoupling capacitor values and placement are described in the Xilinx UG570 guide. Typically, 0.01 μF to 0.1 μF capacitors are used, placed as close as possible to the FPGA power pins.