Part Details for XCKU3P-1FFVD900I by AMD Xilinx
Overview of XCKU3P-1FFVD900I by AMD Xilinx
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (4 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for XCKU3P-1FFVD900I
| Part # | Distributor | Description | Stock | Price | Buy | |
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MacroQuest Electronics | FPGA Kintex UltraScale+ Family 355950 Cells 20nm 0.85V 900-Pin FCBGA Tray | 200 |
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$1,475.6300 / $1,850.2600 | Buy Now |
Part Details for XCKU3P-1FFVD900I
XCKU3P-1FFVD900I CAD Models
XCKU3P-1FFVD900I Part Data Attributes
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XCKU3P-1FFVD900I
AMD Xilinx
Buy Now
Datasheet
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Compare Parts:
XCKU3P-1FFVD900I
AMD Xilinx
Field Programmable Gate Array,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 52 Weeks | |
| Date Of Intro | 2016-06-03 | |
| JESD-30 Code | S-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Length | 31 mm | |
| Moisture Sensitivity Level | 4 | |
| Number of CLBs | 20340 | |
| Number of Inputs | 304 | |
| Number of Logic Cells | 355950 | |
| Number of Outputs | 304 | |
| Number of Terminals | 900 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 20340 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Seated Height-Max | 3.42 mm | |
| Supply Voltage-Max | 0.876 V | |
| Supply Voltage-Min | 0.825 V | |
| Supply Voltage-Nom | 0.85 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 31 mm |
Alternate Parts for XCKU3P-1FFVD900I
This table gives cross-reference parts and alternative options found for XCKU3P-1FFVD900I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XCKU3P-1FFVD900I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| XCKU3P-1SFVB784I | Field Programmable Gate Array, | AMD Xilinx | XCKU3P-1FFVD900I vs XCKU3P-1SFVB784I |
| XCKU3P-1FFVA676I | Field Programmable Gate Array, | AMD Xilinx | XCKU3P-1FFVD900I vs XCKU3P-1FFVA676I |
| XCKU3P-1SFVB784E | Field Programmable Gate Array, | AMD Xilinx | XCKU3P-1FFVD900I vs XCKU3P-1SFVB784E |
| XCKU3P-1FFVB676I | Field Programmable Gate Array, | AMD Xilinx | XCKU3P-1FFVD900I vs XCKU3P-1FFVB676I |