Part Details for XCF02SVO20C by AMD Xilinx
Overview of XCF02SVO20C by AMD Xilinx
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (3 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Industrial Automation
Computing and Data Storage
Telecommunications
Robotics and Drones
Price & Stock for XCF02SVO20C
| Part # | Distributor | Description | Stock | Price | Buy | |
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Quest Components | Serial EEPROM, 20 Pin, Plastic, TSSOP | 3 |
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$13.5000 | Buy Now |
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NexGen Digital | 26 |
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RFQ | ||
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Chip 1 Exchange | INSTOCK | 31 |
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RFQ | |
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Chip1Cloud | 10600 |
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RFQ |
Part Details for XCF02SVO20C
XCF02SVO20C CAD Models
XCF02SVO20C Part Data Attributes:
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XCF02SVO20C
AMD Xilinx
Buy Now
Datasheet
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Compare Parts:
XCF02SVO20C
AMD Xilinx
Configuration Memory, 2MX1, Serial, CMOS, PDSO20, PLASTIC, TSSOP-20
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | TSSOP | |
| Package Description | PLASTIC, TSSOP-20 | |
| Pin Count | 20 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Additional Feature | IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL | |
| Data Retention Time-Min | 20 | |
| Endurance | 20000 Write/Erase Cycles | |
| JESD-30 Code | R-PDSO-G20 | |
| JESD-609 Code | e0 | |
| Length | 6.5024 mm | |
| Memory Density | 2097152 bit | |
| Memory IC Type | CONFIGURATION MEMORY | |
| Memory Width | 1 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 20 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 2MX1 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Equivalence Code | TSSOP20,.25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | 225 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.19 mm | |
| Standby Current-Max | 0.001 A | |
| Supply Current-Max | 0.01 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Type | NOR TYPE | |
| Width | 4.4 mm |
Alternate Parts for XCF02SVO20C
This table gives cross-reference parts and alternative options found for XCF02SVO20C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XCF02SVO20C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| XCF02SVO20C0936 | Configuration Memory, 2MX1, Serial, CMOS, PDSO20, PLASTIC, TSSOP-20 | AMD Xilinx | XCF02SVO20C vs XCF02SVO20C0936 |
| XCF02SVO20C0901 | Configuration Memory, 2MX1, Serial, CMOS, PDSO20, PLASTIC, TSSOP-20 | AMD Xilinx | XCF02SVO20C vs XCF02SVO20C0901 |
| XCF02SVOG20C0901 | Configuration Memory, 2MX1, Serial, CMOS, PDSO20, LEAD FREE, PLASTIC, TSSOP-20 | AMD Xilinx | XCF02SVO20C vs XCF02SVOG20C0901 |