Part Details for XC8101M1375C by Freescale Semiconductor
Overview of XC8101M1375C by Freescale Semiconductor
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- Part Data Attributes: (Available)
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Part Details for XC8101M1375C
XC8101M1375C CAD Models
XC8101M1375C Part Data Attributes
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XC8101M1375C
Freescale Semiconductor
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Datasheet
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XC8101M1375C
Freescale Semiconductor
IC,DSP,16-BIT,CMOS,BGA,332PIN,PLASTIC
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MOTOROLA SEMICONDUCTOR PRODUCTS | |
| Package Description | FBGA, BGA332,19X19,32 | |
| Reach Compliance Code | unknown | |
| Bit Size | 16 | |
| Format | FIXED-POINT | |
| JESD-30 Code | S-PBGA-332 | |
| Number of Terminals | 332 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA332,19X19,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Power Supplies | 1.6,3.3 V | |
| Qualification Status | Not Qualified | |
| RAM (words) | 524288 | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM |