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Part Details for XC7Z100-2FFG900I by AMD
Overview of XC7Z100-2FFG900I by AMD
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for XC7Z100-2FFG900I
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
32AC9859
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Newark | Psoc, Arm Cortex-A9, 800Mhz, Fcbga-900, Product Range:Zynq Family 7000 Series Microprocessors, Cpu Speed:800Mhz, Core Architecture:Arm Cortex-A9, Mpu Case Style:Fcbga, No. Of Pins:900Pins, Msl:-, Ic Case/Package:Fcbga Rohs Compliant: Yes |Amd XC7Z100-2FFG900I RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 0 |
|
$3,446.0700 | Buy Now |
|
DISTI #
122-2129-ND
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DigiKey | IC SOC CORTEX-A9 800MHZ 900FCBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray |
27 In Stock |
|
$3,502.5000 | Buy Now |
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DISTI #
217-XC7Z100-2FFG900I
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Mouser Electronics | SoC FPGA XC7Z100-2FFG900I RoHS: Compliant | 4 |
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$3,446.0700 | Buy Now |
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DISTI #
XC7Z100-2FFG900I
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Avnet Asia | MPU XC7Z100 32-Bit 1000MHz 900-Pin FFG (Alt: XC7Z100-2FFG900I) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days | 5 |
|
$3,296.4707 / $3,686.8420 | Buy Now |
Part Details for XC7Z100-2FFG900I
XC7Z100-2FFG900I CAD Models
XC7Z100-2FFG900I Part Data Attributes
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XC7Z100-2FFG900I
AMD
Buy Now
Datasheet
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Compare Parts:
XC7Z100-2FFG900I
AMD
SoC, CMOS, PBGA900, FBGA-900
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | FBGA-900 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 16 Weeks | |
| Samacsys Manufacturer | AMD | |
| JESD-30 Code | S-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Length | 27 mm | |
| Moisture Sensitivity Level | 4 | |
| Number of Terminals | 900 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Seated Height-Max | 3.24 mm | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 0.95 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 27 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |