There are no models available for this part yet.
Overview of XC7Z045-1FBG676C by AMD
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 4 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for XC7Z045-1FBG676C by AMD
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
47AC6655
|
Newark | Psoc, Arm Cortex-A9, 667Mhz, Fcbga-676, Product Range:Zynq Family 7000 Series Microprocessors, Cpu Speed:667Mhz, Core Architecture:Arm Cortex-A9, Mpu Case Style:Fcbga, No. Of Pins:676Pins, Mpu Family:Zynq, Mpu Series:7000, Automotiverohs Compliant: Yes |Amd XC7Z045-1FBG676C RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 0 |
|
$1,440.0000 | Buy Now | |
|
DISTI #
122-1902-ND
|
DigiKey | IC SOC CORTEX-A9 667MHZ 676FCBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
|
$1,440.0000 | Buy Now | |
|
DISTI #
XC7Z045-1FBG676C
|
Avnet Americas | MPU Zynq-7000 Thumb-2 32-Bit 667MHz 1.2V/3.3V 676-Pin FCBGA - Trays (Alt: XC7Z045-1FBG676C) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
|
$1,457.2800 | Buy Now | |
|
DISTI #
217-XC7Z045-1FBG676C
|
Mouser Electronics | SoC FPGA XC7Z045-1FBG676C RoHS: Compliant | 0 |
|
$1,497.4600 | Order Now |
CAD Models for XC7Z045-1FBG676C by AMD
Part Data Attributes for XC7Z045-1FBG676C by AMD
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Active
|
|
Ihs Manufacturer
|
ADVANCED MICRO DEVICES INC
|
|
Package Description
|
FBGA-676
|
|
Reach Compliance Code
|
compliant
|
|
Factory Lead Time
|
16 Weeks
|
|
Samacsys Manufacturer
|
AMD
|
|
JESD-30 Code
|
S-PBGA-B676
|
|
JESD-609 Code
|
e1
|
|
Length
|
27 mm
|
|
Moisture Sensitivity Level
|
4
|
|
Number of Terminals
|
676
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
BGA
|
|
Package Equivalence Code
|
BGA676,26X26,40
|
|
Package Shape
|
SQUARE
|
|
Package Style
|
GRID ARRAY
|
|
Peak Reflow Temperature (Cel)
|
250
|
|
Seated Height-Max
|
2.54 mm
|
|
Supply Voltage-Max
|
1.05 V
|
|
Supply Voltage-Min
|
0.95 V
|
|
Supply Voltage-Nom
|
1 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Terminal Finish
|
TIN SILVER COPPER
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1 mm
|
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Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
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Width
|
27 mm
|
|
uPs/uCs/Peripheral ICs Type
|
SoC
|
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