Part Details for XC7Z045-1FBG676C by AMD
Overview of XC7Z045-1FBG676C by AMD
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for XC7Z045-1FBG676C
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
47AC6655
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Newark | Psoc, Arm Cortex-A9, 667Mhz, Fcbga-676, Product Range:Zynq Family 7000 Series Microprocessors, Cpu Speed:667Mhz, Core Architecture:Arm Cortex-A9, Mpu Case Style:Fcbga, No. Of Pins:676Pins, Mpu Family:Zynq, Mpu Series:7000, Automotiverohs Compliant: Yes |Amd XC7Z045-1FBG676C RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 0 |
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$1,440.0000 | Buy Now |
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DISTI #
122-1902-ND
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DigiKey | IC SOC CORTEX-A9 667MHZ 676FCBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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$1,440.0000 | Buy Now |
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DISTI #
XC7Z045-1FBG676C
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Avnet Americas | MPU Zynq-7000 Thumb-2 32-Bit 667MHz 1.2V/3.3V 676-Pin FCBGA - Trays (Alt: XC7Z045-1FBG676C) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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$1,457.2800 | Buy Now |
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DISTI #
217-XC7Z045-1FBG676C
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Mouser Electronics | SoC FPGA XC7Z045-1FBG676C RoHS: Compliant | 0 |
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$1,497.4600 | Order Now |
Part Details for XC7Z045-1FBG676C
XC7Z045-1FBG676C CAD Models
XC7Z045-1FBG676C Part Data Attributes
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XC7Z045-1FBG676C
AMD
Buy Now
Datasheet
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Compare Parts:
XC7Z045-1FBG676C
AMD
SoC, CMOS, PBGA676, FBGA-676
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | FBGA-676 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 16 Weeks | |
| Samacsys Manufacturer | AMD | |
| JESD-30 Code | S-PBGA-B676 | |
| JESD-609 Code | e1 | |
| Length | 27 mm | |
| Moisture Sensitivity Level | 4 | |
| Number of Terminals | 676 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 250 | |
| Seated Height-Max | 2.54 mm | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 0.95 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 27 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |