Part Details for XC7Z030-3FFG676E by AMD Xilinx
Overview of XC7Z030-3FFG676E by AMD Xilinx
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Telecommunications
Price & Stock for XC7Z030-3FFG676E
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
47AC6642
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Newark | Psoc, Arm Cortex-A9, 1Ghz, Fcbga-676, Product Range:Zynq Family 7000 Series Microprocessors, Cpu Speed:1Ghz, Core Architecture:Arm Cortex-A9, Mpu Case Style:Fcbga, No. Of Pins:676Pins, Mpu Family:Zynq, Mpu Series:7000, Automotive Rohs Compliant: Yes |Amd Xilinx XC7Z030-3FFG676E Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 13 |
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$673.3000 | Buy Now |
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DISTI #
2831204
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element14 Asia-Pacific | PSOC, ARM CORTEX-A9, 1GHZ, FCBGA-676 RoHS: Compliant Min Qty: 1 Container: Each | 13 |
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$709.9836 | Buy Now |
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DISTI #
2831204
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Farnell | PSOC, ARM CORTEX-A9, 1GHZ, FCBGA-676 RoHS: Compliant Min Qty: 1 Lead time: 17 Weeks, 1 Days Container: Each | 13 |
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$690.6223 | Buy Now |
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MacroQuest Electronics | MPU Zynq-7000 Thumb-2 32-Bit 667MHz 1.2V/3.3V 676-Pin FCBGA | 900 |
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$504.2100 / $584.2500 | Buy Now |
Part Details for XC7Z030-3FFG676E
XC7Z030-3FFG676E CAD Models
XC7Z030-3FFG676E Part Data Attributes:
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XC7Z030-3FFG676E
AMD Xilinx
Buy Now
Datasheet
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Compare Parts:
XC7Z030-3FFG676E
AMD Xilinx
Multifunction Peripheral, CMOS, PBGA676, BGA-676
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 65 Weeks | |
| JESD-30 Code | S-PBGA-B676 | |
| Length | 27 mm | |
| Number of Terminals | 676 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Seated Height-Max | 3.24 mm | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 0.95 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |