Part Details for XC7VX485T-3FFG1158E by AMD
Overview of XC7VX485T-3FFG1158E by AMD
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for XC7VX485T-3FFG1158E
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
XC7VX485T-3FFG1158E-ND
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DigiKey | IC FPGA 350 I/O 1158FCBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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$12,280.0000 | Buy Now |
DISTI #
217-VX485T-3FFG1158E
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Mouser Electronics | FPGA - Field Programmable Gate Array XC7VX485T-3FFG1158E RoHS: Compliant | 0 |
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$12,082.1500 | Order Now |
Part Details for XC7VX485T-3FFG1158E
XC7VX485T-3FFG1158E CAD Models
XC7VX485T-3FFG1158E Part Data Attributes
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XC7VX485T-3FFG1158E
AMD
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Datasheet
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XC7VX485T-3FFG1158E
AMD
Field Programmable Gate Array, 37950 CLBs, 1818MHz, 485760-Cell, CMOS, PBGA1158,
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Reach Compliance Code | compliant | |
Factory Lead Time | 16 Weeks | |
Clock Frequency-Max | 1818 MHz | |
Combinatorial Delay of a CLB-Max | 0.58 ns | |
JESD-30 Code | S-PBGA-B1158 | |
JESD-609 Code | e1 | |
Length | 35 mm | |
Moisture Sensitivity Level | 4 | |
Number of CLBs | 37950 | |
Number of Inputs | 350 | |
Number of Logic Cells | 485760 | |
Number of Outputs | 350 | |
Number of Terminals | 1158 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | ||
Organization | 37950 CLBS | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1156,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 245 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 3.35 mm | |
Supply Voltage-Max | 1.03 V | |
Supply Voltage-Min | 0.97 V | |
Supply Voltage-Nom | 1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 35 mm |