Datasheets
XC7VX330T-3FFG1761E by:

Field Programmable Gate Array, 25500 CLBs, 1818MHz, 326400-Cell, CMOS, PBGA1761,

Part Details for XC7VX330T-3FFG1761E by AMD

Overview of XC7VX330T-3FFG1761E by AMD

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Price & Stock for XC7VX330T-3FFG1761E

Part # Distributor Description Stock Price Buy
DISTI # XC7VX330T-3FFG1761E-ND
DigiKey IC FPGA 700 I/O 1761FCBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray Temporarily Out of Stock
  • 1 $9,728.7500
$9,728.7500 Buy Now
DISTI # XC7VX330T-3FFG1761
Avnet Americas FPGA Virtex-7 XT Family 326400 Cells 28nm Technology 1V 1761-Pin FCBGA - Trays (Alt: XC7VX330T-3FFG1761) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray 0
  • 1 $9,845.4950
$9,845.4950 Buy Now
DISTI # 217-VX330T-3FFG1761E
Mouser Electronics FPGA - Field Programmable Gate Array XC7VX330T-3FFG1761E RoHS: Compliant 0
  • 1 $9,572.0000
$9,572.0000 Order Now
DISTI # XC7VX330T-3FFG1761E
Avnet Asia FPGA Virtex-7 XT Family 326400 Cells 28nm Technology 1V 1761-Pin FCBGA (Alt: XC7VX330T-3FFG1761E) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days 0
  • 1 $10,240.7890
  • 2 $10,107.7920
  • 3 $9,978.2050
  • 5 $9,851.8980
  • 10 $9,608.6420
  • 25 $9,377.1080
  • 50 $9,156.4710
$9,156.4710 / $10,240.7890 Buy Now

Part Details for XC7VX330T-3FFG1761E

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XC7VX330T-3FFG1761E Part Data Attributes

XC7VX330T-3FFG1761E AMD
Buy Now Datasheet
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XC7VX330T-3FFG1761E AMD Field Programmable Gate Array, 25500 CLBs, 1818MHz, 326400-Cell, CMOS, PBGA1761,
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Reach Compliance Code compliant
Factory Lead Time 16 Weeks
Samacsys Manufacturer AMD
Clock Frequency-Max 1818 MHz
Combinatorial Delay of a CLB-Max 0.58 ns
JESD-30 Code S-PBGA-B1761
JESD-609 Code e1
Length 42.5 mm
Moisture Sensitivity Level 4
Number of CLBs 25500
Number of Inputs 650
Number of Logic Cells 326400
Number of Outputs 650
Number of Terminals 1761
Operating Temperature-Max 100 °C
Operating Temperature-Min
Organization 25500 CLBS
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1924,44X44,40
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 3.5 mm
Supply Voltage-Max 1.03 V
Supply Voltage-Min 0.97 V
Supply Voltage-Nom 1 V
Surface Mount YES
Technology CMOS
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 42.5 mm

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