Datasheets
XC7K325T-2FBG900C by:
AMD
AMD
AMD Xilinx
Not Found

Field Programmable Gate Array, 25475 CLBs, 1818MHz, 326080-Cell, CMOS, PBGA900,

Part Details for XC7K325T-2FBG900C by AMD

Results Overview of XC7K325T-2FBG900C by AMD

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XC7K325T-2FBG900C Information

XC7K325T-2FBG900C by AMD is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.

Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.

Price & Stock for XC7K325T-2FBG900C

Part # Distributor Description Stock Price Buy
DISTI # 47AC6533
Newark Fpga, Kintex-7 , 350 I/O, Fcbga-900, No. Of Logic Blocks:50950, No. Of Macrocells:326080, Fpga Fa... mily:Kintex-7, Logic Case Style:Fcbga, No. Of Pins:900Pins, No. Of Speed Grades:2, Total Ram Bits:16020Kbit, No. Of I/O S:350I/O S, Rohs Compliant: Yes |Amd XC7K325T-2FBG900C more RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk 0
  • 1 $2,045.2500
$2,045.2500 Buy Now
DISTI # XC7K325T-2FBG900C-ND
DigiKey IC FPGA 500 I/O 900FCBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray Temporarily Out of Stock
  • 1 $2,078.7500
$2,078.7500 Buy Now
DISTI # 217-C7K325T-2FBG900C
Mouser Electronics FPGA - Field Programmable Gate Array XC7K325T-2FBG900C RoHS: Compliant 3
  • 1 $2,045.2500
$2,045.2500 Buy Now
DISTI # XC7K325T-2FBG900C
Avnet Silica (Alt: XC7K325T-2FBG900C) RoHS: Compliant Min Qty: 1 Package Multiple: 27 Lead time: 17 Weeks, 0 Days Silica - 0
Buy Now
DISTI # XC7K325T-2FBG900C
EBV Elektronik (Alt: XC7K325T-2FBG900C) RoHS: Compliant Min Qty: 1 Package Multiple: 27 Lead time: 18 Weeks, 0 Days EBV - 0
Buy Now
DISTI # XC7K325T-2FBG900C
EBV Elektronik (Alt: XC7K325T-2FBG900C) RoHS: Compliant Min Qty: 1 Package Multiple: 27 Lead time: 18 Weeks, 0 Days EBV - 0
Buy Now

Part Details for XC7K325T-2FBG900C

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XC7K325T-2FBG900C Part Data Attributes

XC7K325T-2FBG900C AMD
Buy Now Datasheet
Compare Parts:
XC7K325T-2FBG900C AMD Field Programmable Gate Array, 25475 CLBs, 1818MHz, 326080-Cell, CMOS, PBGA900,
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Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Package Description BGA-900
Reach Compliance Code compliant
Factory Lead Time 16 Weeks
Samacsys Manufacturer AMD
Clock Frequency-Max 1818 MHz
Combinatorial Delay of a CLB-Max 0.25 ns
JESD-30 Code S-PBGA-B900
JESD-609 Code e1
Length 31 mm
Moisture Sensitivity Level 4
Number of CLBs 25475
Number of Inputs 500
Number of Logic Cells 326080
Number of Outputs 500
Number of Terminals 900
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 25475 CLBS
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA900,30X30,40
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 2.54 mm
Supply Voltage-Max 1.03 V
Supply Voltage-Min 0.97 V
Supply Voltage-Nom 1 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 31 mm

Alternate Parts for XC7K325T-2FBG900C

This table gives cross-reference parts and alternative options found for XC7K325T-2FBG900C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC7K325T-2FBG900C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
XC7K325T-2FB900C AMD Xilinx Check for Price Field Programmable Gate Array, 1818MHz, 326080-Cell, CMOS, PBGA900, XC7K325T-2FBG900C vs XC7K325T-2FB900C
XC7K325T-2FBG900I AMD Xilinx Check for Price Field Programmable Gate Array, 25475 CLBs, 1286MHz, 326080-Cell, CMOS, PBGA900, FBGA-900 XC7K325T-2FBG900C vs XC7K325T-2FBG900I
Part Number Manufacturer Composite Price Description Compare
XC7K325T-2FBG900I AMD Check for Price Field Programmable Gate Array, 25475 CLBs, 1818MHz, 326080-Cell, CMOS, PBGA900, XC7K325T-2FBG900C vs XC7K325T-2FBG900I
XC7K325T-2FB900I AMD Xilinx Check for Price Field Programmable Gate Array, 25475 CLBs, 1818MHz, 326080-Cell, CMOS, PBGA900, 31 X 31 MM, 1 MM PITCH, FBGA-900 XC7K325T-2FBG900C vs XC7K325T-2FB900I
XC7K325T-2FBV900C AMD Xilinx Check for Price Field Programmable Gate Array, 25475 CLBs, PBGA900, FBGA-900 XC7K325T-2FBG900C vs XC7K325T-2FBV900C
XC7K325T-2FFV900I AMD Xilinx Check for Price Field Programmable Gate Array, 25475 CLBs, PBGA900, FBGA-900 XC7K325T-2FBG900C vs XC7K325T-2FFV900I
XC7K325T-2FF900C AMD Check for Price Field Programmable Gate Array, 25475 CLBs, 1818MHz, 326080-Cell, CMOS, PBGA900, FBGA-900 XC7K325T-2FBG900C vs XC7K325T-2FF900C
XC7K325T-2FFG900C AMD $1,854.1453 Field Programmable Gate Array, 25475 CLBs, 1818MHz, 326080-Cell, CMOS, PBGA900, XC7K325T-2FBG900C vs XC7K325T-2FFG900C
XC7K325T-2FFV900C AMD Xilinx Check for Price Field Programmable Gate Array, 25475 CLBs, PBGA900, FBGA-900 XC7K325T-2FBG900C vs XC7K325T-2FFV900C
XC7K325T-2FF900I AMD $2,741.2937 Field Programmable Gate Array, 25475 CLBs, 1818MHz, 326080-Cell, CMOS, PBGA900, FBGA-900 XC7K325T-2FBG900C vs XC7K325T-2FF900I
XC7K325T-2FBV900I AMD Xilinx Check for Price Field Programmable Gate Array, 25475 CLBs, PBGA900, FBGA-900 XC7K325T-2FBG900C vs XC7K325T-2FBV900I
XC7K325T-2FFG900I AMD $2,410.9895 Field Programmable Gate Array, 25475 CLBs, 1818MHz, 326080-Cell, CMOS, PBGA900, XC7K325T-2FBG900C vs XC7K325T-2FFG900I

XC7K325T-2FBG900C Related Parts

XC7K325T-2FBG900C Frequently Asked Questions (FAQ)

  • The maximum operating frequency of the XC7K325T-2FBG900C is 500 MHz, but it depends on the specific application and design implementation.

  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, and optimize clock frequencies, voltage, and logic utilization. Additionally, consider using low-power modes and dynamic voltage and frequency scaling.

  • The -2 speed grade has a maximum clock frequency of 500 MHz, while the -3 speed grade has a maximum clock frequency of 450 MHz. The -3 speed grade is more power-efficient and suitable for applications with lower frequency requirements.

  • The XC7K325T-2FBG900C has an industrial temperature range of -40°C to 100°C. However, it's essential to ensure proper cooling and thermal management to prevent overheating and ensure reliable operation.

  • Use Xilinx's Secure Boot and Authentication features, implement encryption and decryption mechanisms, and consider using a secure key storage solution. Additionally, follow best practices for secure coding and design techniques.