Part Details for XC7K325T-2FB900C by AMD
Overview of XC7K325T-2FB900C by AMD
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Part Details for XC7K325T-2FB900C
XC7K325T-2FB900C CAD Models
XC7K325T-2FB900C Part Data Attributes
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XC7K325T-2FB900C
AMD
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Datasheet
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XC7K325T-2FB900C
AMD
Field Programmable Gate Array, 25475 CLBs, 1818MHz, 326080-Cell, CMOS, PBGA900, FBGA-900
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| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | FBGA-900 | |
| Reach Compliance Code | not_compliant | |
| Clock Frequency-Max | 1818 MHz | |
| Combinatorial Delay of a CLB-Max | 0.25 ns | |
| JESD-30 Code | S-PBGA-B900 | |
| JESD-609 Code | e0 | |
| Length | 31 mm | |
| Moisture Sensitivity Level | 4 | |
| Number of CLBs | 25475 | |
| Number of Inputs | 500 | |
| Number of Logic Cells | 326080 | |
| Number of Outputs | 500 | |
| Number of Terminals | 900 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 25475 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 225 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.54 mm | |
| Supply Voltage-Max | 1.03 V | |
| Supply Voltage-Min | 0.97 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 31 mm |