Part Details for XC7A15T-L1FTG256I by AMD Xilinx
Overview of XC7A15T-L1FTG256I by AMD Xilinx
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Computing and Data Storage
Telecommunications
Price & Stock for XC7A15T-L1FTG256I
| Part # | Distributor | Description | Stock | Price | Buy | |
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MacroQuest Electronics | FPGA Artix-7 16640 Cells 28nm Technology 1V 236-Pin FBGA | 1800 |
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$35.3200 / $36.8400 | Buy Now |
Part Details for XC7A15T-L1FTG256I
XC7A15T-L1FTG256I CAD Models
XC7A15T-L1FTG256I Part Data Attributes
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XC7A15T-L1FTG256I
AMD Xilinx
Buy Now
Datasheet
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XC7A15T-L1FTG256I
AMD Xilinx
Field Programmable Gate Array, 1300 CLBs, PBGA256, FBGA-256
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 65 Weeks | |
| Clock Frequency-Max | 1098 MHz | |
| Combinatorial Delay of a CLB-Max | 1.27 ns | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e1 | |
| Length | 17 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 1300 | |
| Number of Inputs | 250 | |
| Number of Logic Cells | 16640 | |
| Number of Outputs | 250 | |
| Number of Terminals | 256 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 1300 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Seated Height-Max | 1.55 mm | |
| Supply Voltage-Max | 0.98 V | |
| Supply Voltage-Min | 0.92 V | |
| Supply Voltage-Nom | 0.95 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 17 mm |