Part Details for XC6VSX315T-1LFF1156C by AMD
Overview of XC6VSX315T-1LFF1156C by AMD
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- Part Data Attributes: (Available)
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Part Details for XC6VSX315T-1LFF1156C
XC6VSX315T-1LFF1156C CAD Models
XC6VSX315T-1LFF1156C Part Data Attributes
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XC6VSX315T-1LFF1156C
AMD
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Datasheet
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XC6VSX315T-1LFF1156C
AMD
Field Programmable Gate Array, PBGA1156, FBGA-1156
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| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | FBGA-1156 | |
| Reach Compliance Code | compliant | |
| Clock Frequency-Max | 1098 MHz | |
| Combinatorial Delay of a CLB-Max | 0.4 ns | |
| JESD-30 Code | S-PBGA-B1156 | |
| JESD-609 Code | e0 | |
| Length | 35 mm | |
| Moisture Sensitivity Level | 4 | |
| Number of Inputs | 600 | |
| Number of Outputs | 600 | |
| Number of Terminals | 1156 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 24600 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 225 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.5 mm | |
| Supply Voltage-Max | 0.93 V | |
| Supply Voltage-Min | 0.87 V | |
| Supply Voltage-Nom | 0.9 V | |
| Surface Mount | YES | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 35 mm |