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Overview of XC6VLX550T-L1FFG1759I by AMD
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for XC6VLX550T-L1FFG1759I by AMD
Part Data Attributes for XC6VLX550T-L1FFG1759I by AMD
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Rohs Code
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Yes
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Part Life Cycle Code
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Active
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Ihs Manufacturer
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ADVANCED MICRO DEVICES INC
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Package Description
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42.50 X 42.50 MM, LEAD FREE, FBGA-1759
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Reach Compliance Code
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not_compliant
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Clock Frequency-Max
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1098 MHz
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Combinatorial Delay of a CLB-Max
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5.87 ns
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JESD-30 Code
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S-PBGA-B1759
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JESD-609 Code
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e1
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Length
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42.5 mm
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Moisture Sensitivity Level
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4
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Number of Inputs
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840
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Number of Logic Cells
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549888
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Number of Outputs
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840
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Number of Terminals
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1759
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Operating Temperature-Max
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100 °C
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Operating Temperature-Min
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-40 °C
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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BGA
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Package Equivalence Code
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BGA1759,42X42,40
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Package Shape
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SQUARE
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Package Style
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GRID ARRAY
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Peak Reflow Temperature (Cel)
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245
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Programmable Logic Type
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FIELD PROGRAMMABLE GATE ARRAY
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Qualification Status
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Not Qualified
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Seated Height-Max
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3.5 mm
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Supply Voltage-Max
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0.93 V
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Supply Voltage-Min
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0.87 V
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Supply Voltage-Nom
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0.9 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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INDUSTRIAL
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Terminal Finish
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TIN SILVER COPPER
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Terminal Form
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BALL
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Terminal Pitch
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1 mm
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Terminal Position
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BOTTOM
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Time@Peak Reflow Temperature-Max (s)
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30
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Width
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42.5 mm
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