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Field Programmable Gate Array, 1286MHz, 241152-Cell, CMOS, PBGA784, 29 X 29 MM, LEAD FREE, FBGA-784
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Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
XC6VLX240T-2FFG784C-ND
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DigiKey | IC FPGA 400 I/O 784FCBGA Min Qty: 1 Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
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$3,082.5000 | Buy Now |
DISTI #
XC6VLX240T-2FFG784
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Avnet Americas | FPGA Virtex-6 LXT Family 241152 Cells 40nm (CMOS) Technology 1V 784-Pin FC-BGA - Trays (Alt: XC6VLX240T-2FFG784) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 12 Weeks, 0 Days Container: Tray | 0 |
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$3,119.4900 | Buy Now |
DISTI #
217-VLX240T-2FFG784C
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Mouser Electronics | FPGA - Field Programmable Gate Array XC6VLX240T-2FFG784C RoHS: Compliant | 0 |
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$3,032.8300 | Order Now |
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XC6VLX240T-2FFG784C
AMD
Buy Now
Datasheet
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Compare Parts:
XC6VLX240T-2FFG784C
AMD
Field Programmable Gate Array, 1286MHz, 241152-Cell, CMOS, PBGA784, 29 X 29 MM, LEAD FREE, FBGA-784
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Package Description | 29 X 29 MM, LEAD FREE, FBGA-784 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 12 Weeks | |
Samacsys Manufacturer | AMD | |
Clock Frequency-Max | 1286 MHz | |
Combinatorial Delay of a CLB-Max | 0.31 ns | |
JESD-30 Code | S-PBGA-B784 | |
JESD-609 Code | e1 | |
Length | 29 mm | |
Moisture Sensitivity Level | 4 | |
Number of Inputs | 400 | |
Number of Logic Cells | 241152 | |
Number of Outputs | 400 | |
Number of Terminals | 784 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Organization | 18840 CLBS | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA784,28X28,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 245 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 3.1 mm | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 0.95 V | |
Supply Voltage-Nom | 1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 29 mm |