Part Details for XC6VHX380T-1FFG1154I by AMD
Overview of XC6VHX380T-1FFG1154I by AMD
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Part Details for XC6VHX380T-1FFG1154I
XC6VHX380T-1FFG1154I CAD Models
XC6VHX380T-1FFG1154I Part Data Attributes
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XC6VHX380T-1FFG1154I
AMD
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Datasheet
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XC6VHX380T-1FFG1154I
AMD
Field Programmable Gate Array, 1098MHz, 382464-Cell, CMOS, PBGA1154, 35 X 35 MM, LEAD FREE, FBGA-1154
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | 35 X 35 MM, LEAD FREE, FBGA-1154 | |
| Reach Compliance Code | not_compliant | |
| Clock Frequency-Max | 1098 MHz | |
| Combinatorial Delay of a CLB-Max | 0.36 ns | |
| JESD-30 Code | S-PBGA-B1154 | |
| JESD-609 Code | e1 | |
| Length | 35 mm | |
| Moisture Sensitivity Level | 4 | |
| Number of Inputs | 320 | |
| Number of Logic Cells | 382464 | |
| Number of Outputs | 320 | |
| Number of Terminals | 1154 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 29880 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1154,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.5 mm | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 0.95 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 35 mm |