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Part Details for XC6SLX25-3FTG256C by AMD
Overview of XC6SLX25-3FTG256C by AMD
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for XC6SLX25-3FTG256C
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
122-1956-ND
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DigiKey | IC FPGA 186 I/O 256FTBGA Min Qty: 1 Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
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$64.8800 | Buy Now |
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DISTI #
217-C6SLX25-3FTG256C
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Mouser Electronics | FPGA - Field Programmable Gate Array XC6SLX25-3FTG256C RoHS: Compliant | 5 |
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$72.6500 | Buy Now |
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DISTI #
XC6SLX25-3FTG256C
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Avnet Asia | FPGA Spartan-6 LX Family 24051 Cells 45nm (CMOS) Technology 1.2V 256-Pin FTBGA (Alt: XC6SLX25-3FTG256C) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 12 Weeks, 0 Days | 5 |
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$61.0588 / $86.5000 | Buy Now |
Part Details for XC6SLX25-3FTG256C
XC6SLX25-3FTG256C CAD Models
XC6SLX25-3FTG256C Part Data Attributes
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XC6SLX25-3FTG256C
AMD
Buy Now
Datasheet
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Compare Parts:
XC6SLX25-3FTG256C
AMD
Field Programmable Gate Array, 1879 CLBs, 862MHz, 24051-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 12 Weeks | |
| Samacsys Manufacturer | AMD | |
| Clock Frequency-Max | 862 MHz | |
| Combinatorial Delay of a CLB-Max | 0.21 ns | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e1 | |
| Length | 17 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 1879 | |
| Number of Inputs | 186 | |
| Number of Logic Cells | 24051 | |
| Number of Outputs | 186 | |
| Number of Terminals | 256 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 1879 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.55 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 17 mm |