There are no models available for this part yet.
Overview of XC4VFX60-11FFG1152I by AMD
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 3 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for XC4VFX60-11FFG1152I by AMD
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
XC4VFX60-11FFG1152I-ND
|
DigiKey | IC FPGA 576 I/O 1152FCBGA Min Qty: 1 Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
|
$2,766.2500 | Buy Now | |
DISTI #
XC4VFX60-11FFG1152
|
Avnet Americas | FPGA Virtex-4 FX Family 56880 Cells 90nm (CMOS) Technology 1.2V 1152-Pin FC-BGA - Trays (Alt: XC4VFX60-11FFG1152) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 12 Weeks, 0 Days Container: Tray | 0 |
|
$2,799.4450 | Buy Now | |
DISTI #
217-VFX60-11FFG1152I
|
Mouser Electronics | FPGA - Field Programmable Gate Array BOM fix disconnect standard BOM RoHS: Compliant | 0 |
|
$2,721.6800 | Order Now |
CAD Models for XC4VFX60-11FFG1152I by AMD
Part Data Attributes for XC4VFX60-11FFG1152I by AMD
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
ADVANCED MICRO DEVICES INC
|
Package Description
|
LEAD FREE, FBGA-1152
|
Reach Compliance Code
|
not_compliant
|
Factory Lead Time
|
12 Weeks
|
Samacsys Manufacturer
|
AMD
|
Clock Frequency-Max
|
1181 MHz
|
Combinatorial Delay of a CLB-Max
|
0.17 ns
|
JESD-30 Code
|
S-PBGA-B1152
|
JESD-609 Code
|
e1
|
Length
|
35 mm
|
Moisture Sensitivity Level
|
4
|
Number of CLBs
|
6320
|
Number of Inputs
|
576
|
Number of Logic Cells
|
56880
|
Number of Outputs
|
576
|
Number of Terminals
|
1152
|
Operating Temperature-Max
|
100 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
6320 CLBS
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
BGA
|
Package Equivalence Code
|
BGA1152,34X34,40
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY
|
Peak Reflow Temperature (Cel)
|
245
|
Programmable Logic Type
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
3.4 mm
|
Supply Voltage-Max
|
1.26 V
|
Supply Voltage-Min
|
1.14 V
|
Supply Voltage-Nom
|
1.2 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Terminal Finish
|
TIN SILVER COPPER
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
Width
|
35 mm
|
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