Programmable Logic Field Programmable Gate Arrays XC3S200-4FT256C

XC3S200-4FT256C by

Description: Field Programmable Gate Array, 480 CLBs, 200000 Gates, 630MHz, 4320-Cell, CMOS, PBGA256, 17 X 17 MM, FTBGA-256

Overview of XC3S200-4FT256C by AMD

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Show differences only	XC3S200-4FT256C AMD Buy Now	part-to-be-compared AMD Buy Now
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Rohs Code	No
Part Life Cycle Code	Obsolete
Ihs Manufacturer	ADVANCED MICRO DEVICES INC
Package Description	17 X 17 MM, FTBGA-256
Reach Compliance Code	not_compliant
Samacsys Manufacturer	AMD
Clock Frequency-Max	630 MHz
Combinatorial Delay of a CLB-Max	0.61 ns
JESD-30 Code	S-PBGA-B256
JESD-609 Code	e0
Length	17 mm
Moisture Sensitivity Level	3
Number of CLBs	480
Number of Equivalent Gates	200000
Number of Inputs	173
Number of Logic Cells	4320
Number of Outputs	173
Number of Terminals	256
Operating Temperature-Max	85 °C
Operating Temperature-Min
Organization	480 CLBS, 200000 GATES
Package Body Material	PLASTIC/EPOXY
Package Code	LBGA
Package Equivalence Code	BGA256,16X16,40
Package Shape	SQUARE
Package Style	GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)	225
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified
Seated Height-Max	1.55 mm
Supply Voltage-Max	1.26 V
Supply Voltage-Min	1.14 V
Supply Voltage-Nom	1.2 V
Surface Mount	YES
Technology	CMOS
Temperature Grade	OTHER
Terminal Finish	TIN LEAD
Terminal Form	BALL
Terminal Pitch	1 mm
Terminal Position	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30
Width	17 mm

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