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Programmable Logic / Field Programmable Gate Arrays / XC3S1000-4FG320I
Datasheets
XC3S1000-4FG320I by:
AMD
AMD
AMD Xilinx
Not Found

Field Programmable Gate Array, 1920 CLBs, 1000000 Gates, 630MHz, 17280-Cell, CMOS, PBGA320, 19 X 19 MM, FBGA-320

Part Details for XC3S1000-4FG320I by AMD

Results Overview of XC3S1000-4FG320I by AMD

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XC3S1000-4FG320I Information

XC3S1000-4FG320I by AMD is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.

Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.

Price & Stock for XC3S1000-4FG320I

Part # Distributor Description Stock Price Buy
DISTI # 122-2135-ND
DigiKey IC FPGA 221 I/O 320FBGA Min Qty: 1 Lead time: 16 Weeks Container: Bulk 6580
In Stock
  • 1 $151.8000
$151.8000 Buy Now
DISTI # XC3S1000-4FG320I
Avnet Asia FPGA Spartan-3 Family 1M Gates 17280 Cells 630MHz 90nm Technology 1.2V 320-Pin F-BGA (Alt: XC3S1000-... 4FG320I) more RoHS: Not Compliant Min Qty: 1 Package Multiple: 1 0
RFQ
DISTI # XC3S1000-4FG320I
Avnet Silica (Alt: XC3S1000-4FG320I) RoHS: Not Compliant Min Qty: 4 Package Multiple: 84 Lead time: 143 Weeks, 0 Days Silica - 0
Buy Now
DISTI # XC3S1000-4FG320I
EBV Elektronik (Alt: XC3S1000-4FG320I) RoHS: Not Compliant Min Qty: 4 Package Multiple: 1 Lead time: 143 Weeks, 0 Days EBV - 0
Buy Now

Part Details for XC3S1000-4FG320I

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XC3S1000-4FG320I Part Data Attributes

Parametric Data
XC3S1000-4FG320I AMD
Buy Now Datasheet
Compare Parts:
XC3S1000-4FG320I AMD Field Programmable Gate Array, 1920 CLBs, 1000000 Gates, 630MHz, 17280-Cell, CMOS, PBGA320, 19 X 19 MM, FBGA-320
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Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Package Description 19 X 19 MM, FBGA-320
Reach Compliance Code not_compliant
Samacsys Manufacturer AMD
Clock Frequency-Max 630 MHz
Combinatorial Delay of a CLB-Max 0.61 ns
JESD-30 Code S-PBGA-B320
JESD-609 Code e0
Length 19 mm
Moisture Sensitivity Level 3
Number of CLBs 1920
Number of Equivalent Gates 1000000
Number of Inputs 221
Number of Logic Cells 17280
Number of Outputs 221
Number of Terminals 320
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Organization 1920 CLBS, 1000000 GATES
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA320,18X18,40
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 2 mm
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES
Technology CMOS
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 19 mm

Alternate Parts for XC3S1000-4FG320I

This table gives cross-reference parts and alternative options found for XC3S1000-4FG320I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC3S1000-4FG320I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
XC3S1000-4FG320C AMD Check for Price Field Programmable Gate Array, 1920 CLBs, 1000000 Gates, 630MHz, 17280-Cell, CMOS, PBGA320, 19 X 19 MM, FBGA-320 XC3S1000-4FG320I vs XC3S1000-4FG320C
XC3S1000-4FGG320I AMD Xilinx $72.0900 Field Programmable Gate Array, 1920 CLBs, 1000000 Gates, 630MHz, 17280-Cell, CMOS, PBGA320, 19 X 19 MM, LEAD FREE, FBGA-320 XC3S1000-4FG320I vs XC3S1000-4FGG320I
XC3S1000L-4FGG320C AMD Xilinx Check for Price Field Programmable Gate Array, 1920 CLBs, 1000000 Gates, 17280-Cell, CMOS, PBGA320, LEAD FREE, FBGA-320 XC3S1000-4FG320I vs XC3S1000L-4FGG320C
XC3S1000-4FGG320I AMD Check for Price Field Programmable Gate Array, 1920 CLBs, 1000000 Gates, 630MHz, 17280-Cell, CMOS, PBGA320, 19 X 19 MM, LEAD FREE, FBGA-320 XC3S1000-4FG320I vs XC3S1000-4FGG320I
XC3S1000-4FGG320C AMD Xilinx $56.6801 Field Programmable Gate Array, 1920 CLBs, 1000000 Gates, 630MHz, 17280-Cell, CMOS, PBGA320, 19 X 19 MM, LEAD FREE, FBGA-320 XC3S1000-4FG320I vs XC3S1000-4FGG320C
XC3S1000-4FGG320C AMD Check for Price Field Programmable Gate Array, 1920 CLBs, 1000000 Gates, 630MHz, 17280-Cell, CMOS, PBGA320, 19 X 19 MM, LEAD FREE, FBGA-320 XC3S1000-4FG320I vs XC3S1000-4FGG320C

XC3S1000-4FG320I Related Parts

XC3S1000-4FG320I Frequently Asked Questions (FAQ)

  • The maximum operating temperature range for XC3S1000-4FG320I is -40°C to 100°C.

  • To implement a CDC in XC3S1000-4FG320I, use a synchronizer circuit or a FIFO-based CDC, and ensure that the clock domains are properly isolated and synchronized.

  • The maximum frequency achievable with XC3S1000-4FG320I depends on the design complexity and the clocking architecture. However, the FPGA can support clock frequencies up to 350 MHz.

  • To optimize power consumption in XC3S1000-4FG320I, use power-saving features like clock gating, voltage scaling, and dynamic voltage and frequency scaling. Also, optimize your design for low power consumption by minimizing switching activity and using low-power IP cores.

  • To implement a DDR memory interface in XC3S1000-4FG320I, use the FPGA's built-in DDR memory controller IP core, and follow the guidelines provided in the Xilinx Memory Interface Solutions User Guide.