Part Details for XC2C256-7FT256C by AMD
Overview of XC2C256-7FT256C by AMD
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Part Details for XC2C256-7FT256C
XC2C256-7FT256C CAD Models
XC2C256-7FT256C Part Data Attributes
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XC2C256-7FT256C
AMD
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Datasheet
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XC2C256-7FT256C
AMD
Flash PLD, 7.5ns, 256-Cell, PLA-Type, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FTBGA-256
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Package Description | 17 X 17 MM, 1 MM PITCH, FTBGA-256 | |
Reach Compliance Code | not_compliant | |
Samacsys Manufacturer | AMD | |
Additional Feature | REAL DIGITAL DESIGN TECHNOLOGY | |
Architecture | PLA-TYPE | |
Clock Frequency-Max | 108 MHz | |
In-System Programmable | YES | |
JESD-30 Code | S-PBGA-B256 | |
JESD-609 Code | e0 | |
JTAG BST | YES | |
Length | 17 mm | |
Moisture Sensitivity Level | 3 | |
Number of Dedicated Inputs | ||
Number of I/O Lines | 184 | |
Number of Inputs | 184 | |
Number of Macro Cells | 256 | |
Number of Outputs | 184 | |
Number of Terminals | 256 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 0 DEDICATED INPUTS, 184 I/O | |
Output Function | MACROCELL | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Peak Reflow Temperature (Cel) | 225 | |
Programmable Logic Type | FLASH PLD | |
Propagation Delay | 7.5 ns | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.55 mm | |
Supply Voltage-Max | 1.9 V | |
Supply Voltage-Min | 1.7 V | |
Supply Voltage-Nom | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 17 mm |