Datasheets
XC2269I136F128LRAAKXUMA1 by: Infineon Technologies AG

Microcontroller, 32-Bit, FLASH, 128MHz, CMOS, PQFP100, LQFP-100

Part Details for XC2269I136F128LRAAKXUMA1 by Infineon Technologies AG

Overview of XC2269I136F128LRAAKXUMA1 by Infineon Technologies AG

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Applications Consumer Electronics Internet of Things (IoT) Industrial Automation Smart Cities Transportation and Logistics Renewable Energy Automotive Robotics and Drones

Price & Stock for XC2269I136F128LRAAKXUMA1

Part # Distributor Description Stock Price Buy
DISTI # XC2269I136F128LRAAKXUMA1-ND
DigiKey IC MCU 16/32BIT 1MB FLSH 100LQFP Lead time: 36 Weeks Container: Tape & Reel (TR) Limited Supply - Call
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DISTI # XC2269I136F128LRAA
Avnet Americas MCU 16-Bit XC2000 C166 CISC/DSP/RISC 1088KB Flash 3.3V/5V 100-Pin LQFP T/R - Tape and Reel (Alt: XC2269I136F128LRAA) RoHS: Compliant Min Qty: 1000 Package Multiple: 1000 Lead time: 34 Weeks, 6 Days Container: Reel 0
RFQ
DISTI # SP001217648
EBV Elektronik MCU 16-Bit XC2000 C166 CISC/DSP/RISC 1088KB Flash 3.3V/5V 100-Pin LQFP T/R (Alt: SP001217648) RoHS: Compliant Min Qty: 1000 Package Multiple: 1000 Lead time: 71 Weeks, 0 Days EBV - 0
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Part Details for XC2269I136F128LRAAKXUMA1

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XC2269I136F128LRAAKXUMA1 Part Data Attributes

XC2269I136F128LRAAKXUMA1 Infineon Technologies AG
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XC2269I136F128LRAAKXUMA1 Infineon Technologies AG Microcontroller, 32-Bit, FLASH, 128MHz, CMOS, PQFP100, LQFP-100
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Package Description LQFP-100
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Factory Lead Time 34 Weeks, 6 Days
Date Of Intro 2017-05-24
Has ADC YES
Address Bus Width 24
Bit Size 32
Clock Frequency-Max 40 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width 16
JESD-30 Code S-PQFP-G100
JESD-609 Code e4
Length 14 mm
Moisture Sensitivity Level 3
Number of I/O Lines 73
Number of Terminals 100
On Chip Program ROM Width 8
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
PWM Channels YES
Package Body Material PLASTIC/EPOXY
Package Code HLFQFP
Package Shape SQUARE
Package Style FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
RAM (bytes) 100352
ROM (words) 1114112
ROM Programmability FLASH
Seated Height-Max 1.6 mm
Speed 128 MHz
Supply Voltage-Max 1.6 V
Supply Voltage-Min 1.4 V
Supply Voltage-Nom 1.5 V
Surface Mount YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position QUAD
Width 14 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER

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