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Overview of XC1765EPDG8C by Rochester Electronics LLC
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for XC1765EPDG8C by Rochester Electronics LLC
Part Data Attributes for XC1765EPDG8C by Rochester Electronics LLC
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|
|
|---|---|
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Pbfree Code
|
No
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Rohs Code
|
Yes
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Part Life Cycle Code
|
Active
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Ihs Manufacturer
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ROCHESTER ELECTRONICS LLC
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Part Package Code
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DIP
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Package Description
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DIP,
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Pin Count
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8
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Reach Compliance Code
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unknown
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Additional Feature
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USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
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JESD-30 Code
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R-PDIP-T8
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JESD-609 Code
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e3
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Length
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9.3599 mm
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Memory Density
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65536 bit
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Memory IC Type
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CONFIGURATION MEMORY
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Memory Width
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1
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Moisture Sensitivity Level
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1
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Number of Functions
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1
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Number of Terminals
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8
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Number of Words
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65536 words
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Number of Words Code
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64000
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Operating Mode
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SYNCHRONOUS
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Operating Temperature-Max
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70 °C
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Operating Temperature-Min
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Organization
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64KX1
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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DIP
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Package Shape
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RECTANGULAR
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Package Style
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IN-LINE
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Parallel/Serial
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SERIAL
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Peak Reflow Temperature (Cel)
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250
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Qualification Status
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COMMERCIAL
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Seated Height-Max
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4.5974 mm
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Supply Voltage-Max (Vsup)
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5.25 V
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Supply Voltage-Min (Vsup)
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4.75 V
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Supply Voltage-Nom (Vsup)
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5 V
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Surface Mount
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NO
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Technology
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CMOS
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Temperature Grade
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COMMERCIAL
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Terminal Finish
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MATTE TIN
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Terminal Form
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THROUGH-HOLE
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Terminal Pitch
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2.54 mm
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Terminal Position
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DUAL
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Time@Peak Reflow Temperature-Max (s)
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30
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Width
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7.62 mm
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