Part Details for XC1765DDD8B by AMD Xilinx
Overview of XC1765DDD8B by AMD Xilinx
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- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
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Part Details for XC1765DDD8B
XC1765DDD8B CAD Models
XC1765DDD8B Part Data Attributes
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XC1765DDD8B
AMD Xilinx
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Datasheet
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XC1765DDD8B
AMD Xilinx
Configuration Memory, 64KX1, Serial, CMOS, CDIP8, CERDIP-8
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | DIP | |
| Package Description | CERDIP-8 | |
| Pin Count | 8 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.51 | |
| Clock Frequency-Max (fCLK) | 5 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-GDIP-T8 | |
| JESD-609 Code | e0 | |
| Length | 10.16 mm | |
| Memory Density | 65536 bit | |
| Memory IC Type | CONFIGURATION MEMORY | |
| Memory Width | 1 | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Number of Words | 65536 words | |
| Number of Words Code | 64000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 64KX1 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP8,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | SERIAL | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 Class B | |
| Seated Height-Max | 5.08 mm | |
| Standby Current-Max | 0.0015 A | |
| Supply Current-Max | 0.01 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for XC1765DDD8B
This table gives cross-reference parts and alternative options found for XC1765DDD8B. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC1765DDD8B, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| XC1765D-DD8R | Configuration Memory, 64KX1, Serial, CMOS, CDIP8, CERDIP-8 | AMD Xilinx | XC1765DDD8B vs XC1765D-DD8R |
| XC1765DPD8I | Configuration Memory, 64KX1, Serial, CMOS, PDIP8, PLASTIC, DIP-8 | AMD Xilinx | XC1765DDD8B vs XC1765DPD8I |
| XC1765EDD8M | Configuration Memory, 64KX1, Serial, CMOS, CDIP8, CERAMIC, DIP-8 | AMD Xilinx | XC1765DDD8B vs XC1765EDD8M |
| XC1765EPDG8C | Configuration Memory, 64KX1, Serial, CMOS, PDIP8, LEAD FREE, PLASTIC, DIP-8 | AMD Xilinx | XC1765DDD8B vs XC1765EPDG8C |
| 5962-9471701MPX | Configuration Memory, 64KX1, Serial, CMOS, CDIP8, CERAMIC, DIP-8 | AMD Xilinx | XC1765DDD8B vs 5962-9471701MPX |
| XC1765EPD8C | Configuration Memory, 64KX1, Serial, CMOS, PDIP8, PLASTIC, DIP-8 | AMD Xilinx | XC1765DDD8B vs XC1765EPD8C |
| 5962-9471701MPA | Configuration Memory, 64KX1, Serial, CMOS, CDIP8, CERAMIC, DIP-8 | AMD Xilinx | XC1765DDD8B vs 5962-9471701MPA |
| XC1765EPD8I | Configuration Memory, 64KX1, Serial, CMOS, PDIP8, PLASTIC, DIP-8 | AMD Xilinx | XC1765DDD8B vs XC1765EPD8I |
| XC1765D-DD8M | Configuration Memory, 64KX1, Serial, CMOS, CDIP8, CERAMIC, DIP-8 | AMD Xilinx | XC1765DDD8B vs XC1765D-DD8M |
| XC1765EPDG8I | Configuration Memory, 64KX1, Serial, CMOS, PDIP8, PLASTIC, DIP-8 | AMD Xilinx | XC1765DDD8B vs XC1765EPDG8I |