Part Details for XA7Z010-1CLG400Q by AMD Xilinx
Results Overview of XA7Z010-1CLG400Q by AMD Xilinx
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XA7Z010-1CLG400Q Information
XA7Z010-1CLG400Q by AMD Xilinx is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for XA7Z010-1CLG400Q
Part # | Distributor | Description | Stock | Price | Buy | |
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NexGen Digital | 14690 |
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RFQ | ||
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Win Source Electronics | IC SOC CORTEX-A9 667MHZ 400BGA / Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) I... more | 3278 |
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$41.4500 / $62.1740 | Buy Now |
Part Details for XA7Z010-1CLG400Q
XA7Z010-1CLG400Q CAD Models
XA7Z010-1CLG400Q Part Data Attributes
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XA7Z010-1CLG400Q
AMD Xilinx
Buy Now
Datasheet
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Compare Parts:
XA7Z010-1CLG400Q
AMD Xilinx
Microprocessor Circuit, CMOS, PBGA400, 17 X 17 MM, 0.80 MM PITCH, LEAD FREE, BGA-400
Select a part to compare: |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA-400 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Factory Lead Time | 65 Weeks | |
JESD-30 Code | S-PBGA-B400 | |
JESD-609 Code | e1 | |
Length | 17 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 400 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA400,20X20,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Screening Level | AEC-Q100 | |
Seated Height-Max | 1.6 mm | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 17 mm | |
uPs/uCs/Peripheral ICs Type | SoC |
Alternate Parts for XA7Z010-1CLG400Q
This table gives cross-reference parts and alternative options found for XA7Z010-1CLG400Q. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XA7Z010-1CLG400Q, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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XA7Z010-1CLG400I | AMD Xilinx | Check for Price | Microprocessor Circuit, CMOS, PBGA400, 17 X 17 MM, 0.80 MM PITCH, LEAD FREE, BGA-400 | XA7Z010-1CLG400Q vs XA7Z010-1CLG400I |