Part Details for XA3S250E-4FTG256Q by AMD Xilinx
Overview of XA3S250E-4FTG256Q by AMD Xilinx
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (3 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Industrial Automation
Financial Technology (Fintech)
Computing and Data Storage
Smart Cities
Aerospace and Defense
Telecommunications
Communication and Networking
Automotive
Price & Stock for XA3S250E-4FTG256Q
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
|
Component Electronics, Inc | IN STOCK SHIP TODAY | 950 |
|
$150.0000 / $230.7700 | Buy Now |
Part Details for XA3S250E-4FTG256Q
XA3S250E-4FTG256Q CAD Models
XA3S250E-4FTG256Q Part Data Attributes
|
|
XA3S250E-4FTG256Q
AMD Xilinx
Buy Now
Datasheet
|
Compare Parts:
XA3S250E-4FTG256Q
AMD Xilinx
Field Programmable Gate Array, 612 CLBs, 250000 Gates, 572MHz, 5508-Cell, CMOS, PBGA256, LEAD FREE, FTBGA-256
|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LEAD FREE, FTBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 52 Weeks | |
| Clock Frequency-Max | 572 MHz | |
| Combinatorial Delay of a CLB-Max | 4.88 ns | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e1 | |
| Length | 17 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 612 | |
| Number of Equivalent Gates | 250000 | |
| Number of Inputs | 172 | |
| Number of Logic Cells | 5508 | |
| Number of Outputs | 132 | |
| Number of Terminals | 256 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 612 CLBS, 250000 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1.55 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 17 mm |
Alternate Parts for XA3S250E-4FTG256Q
This table gives cross-reference parts and alternative options found for XA3S250E-4FTG256Q. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XA3S250E-4FTG256Q, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| XA3S250E-4FTG256I | Field Programmable Gate Array, 612 CLBs, 250000 Gates, 572MHz, 5508-Cell, CMOS, PBGA256, LEAD FREE, FTBGA-256 | AMD Xilinx | XA3S250E-4FTG256Q vs XA3S250E-4FTG256I |