Datasheets
X76F640HEG-2.7 by: IC Microsystems Sdn Bhd

Flash, 8KX8, ROHS COMPLIANT, DIE

Part Details for X76F640HEG-2.7 by IC Microsystems Sdn Bhd

Overview of X76F640HEG-2.7 by IC Microsystems Sdn Bhd

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Applications Internet of Things (IoT) Environmental Monitoring Industrial Automation Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Renewable Energy Entertainment and Gaming Robotics and Drones

Part Details for X76F640HEG-2.7

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X76F640HEG-2.7 Part Data Attributes

X76F640HEG-2.7 IC Microsystems Sdn Bhd
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X76F640HEG-2.7 IC Microsystems Sdn Bhd Flash, 8KX8, ROHS COMPLIANT, DIE
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Contact Manufacturer
Ihs Manufacturer IC MICROSYSTEMS SDN BHD
Part Package Code DIE
Package Description ROHS COMPLIANT, DIE
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Clock Frequency-Max (fCLK) 0.4 MHz
JESD-30 Code X-XUUC-N
Memory Density 65536 bit
Memory IC Type FLASH
Memory Width 8
Number of Functions 1
Number of Words 8192 words
Number of Words Code 8000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -20 °C
Organization 8KX8
Package Body Material UNSPECIFIED
Package Code DIE
Package Shape UNSPECIFIED
Package Style UNCASED CHIP
Parallel/Serial SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 2.7 V
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Form NO LEAD
Terminal Position UPPER
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type NOR TYPE
Write Cycle Time-Max (tWC) 10 ms

Alternate Parts for X76F640HEG-2.7

This table gives cross-reference parts and alternative options found for X76F640HEG-2.7. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of X76F640HEG-2.7, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
X76F640HE-2.7 Flash, 8KX8, DIE Xicor Inc X76F640HEG-2.7 vs X76F640HE-2.7
Part Number Description Manufacturer Compare
X76F640WG Flash, 8KX8, ROHS COMPLIANT, WAFER IC Microsystems Sdn Bhd X76F640HEG-2.7 vs X76F640WG
X76F640WE Flash, 8KX8, DIE Xicor Inc X76F640HEG-2.7 vs X76F640WE
X76F641W-2 Flash, 8KX8, WAFER Xicor Inc X76F640HEG-2.7 vs X76F641W-2
X76F640HE-2.7 Flash, 8KX8, DIE IC Microsystems Sdn Bhd X76F640HEG-2.7 vs X76F640HE-2.7
HC6664/1-CH-T IC 8K X 8 OTPROM, 55 ns, UUC, DIE, Programmable ROM Honeywell Sensing and Control X76F640HEG-2.7 vs HC6664/1-CH-T
X76F640H Flash, 8KX8, DIE IC Microsystems Sdn Bhd X76F640HEG-2.7 vs X76F640H
AT25640A-W2.7-11 EEPROM, 8KX8, Serial Microchip Technology Inc X76F640HEG-2.7 vs AT25640A-W2.7-11
HC6664/1-VH-C OTP ROM, 8KX8, 55ns, CMOS, DIE Honeywell Microelectronics & Precision Sensors X76F640HEG-2.7 vs HC6664/1-VH-C
X76F640W Flash, 8KX8, DIE Xicor Inc X76F640HEG-2.7 vs X76F640W
HC6664/1-VHZT IC 8K X 8 OTPROM, 55 ns, UUC, DIE, Programmable ROM Honeywell Sensing and Control X76F640HEG-2.7 vs HC6664/1-VHZT

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